Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading

A three-dimensional finite element model of CMOS image sensor QFN packaging using ANSYS codes is developed to investigate the solder joint reliability under thermal cycle test. The predicted thermal-induced displacements were found to be very good agreement with the Moiré interferometer experimental...

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Veröffentlicht in:	Materials science forum 2008-01, Vol.594, p.175-180
Hauptverfasser:	Lee, Hui Yu, Shieh, Wen Lo, Hsu, Hsiang Chen
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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