Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading
A three-dimensional finite element model of CMOS image sensor QFN packaging using ANSYS codes is developed to investigate the solder joint reliability under thermal cycle test. The predicted thermal-induced displacements were found to be very good agreement with the Moiré interferometer experimental...
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| Veröffentlicht in: | Materials science forum 2008-01, Vol.594, p.175-180 |
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| creator | Lee, Hui Yu Shieh, Wen Lo Hsu, Hsiang Chen |
| description | A three-dimensional finite element model of CMOS image sensor QFN packaging using
ANSYS codes is developed to investigate the solder joint reliability under thermal cycle test. The
predicted thermal-induced displacements were found to be very good agreement with the Moiré
interferometer experimental in-plane deformations. The developed finite element model is then
applied to predict fatigue life of Sn4.0Ag0.5Cu, Sn3.5Ag0.5Cu and Sn3.9Ag0.6Cu alloys based on
JEDEC standard JESD22-A104. In order to save computational time and produce satisfactory results
in the region of interest, an independent more finely meshed so-called submodel scheme based on
cut-boundary displacement method is generated. The mesh density for different area ratio of
refinery/coarse model was verified and the results were found to be good agreement with previous
researches. The modified Coffin-Manson equation and strain energy density based equation are
applied to evaluate the reliability of SnAgCu alloys. A series of comprehensive parametric studies
were conducted in this paper. |
| doi_str_mv | 10.4028/www.scientific.net/MSF.594.175 |
| format | Article |
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ANSYS codes is developed to investigate the solder joint reliability under thermal cycle test. The
predicted thermal-induced displacements were found to be very good agreement with the Moiré
interferometer experimental in-plane deformations. The developed finite element model is then
applied to predict fatigue life of Sn4.0Ag0.5Cu, Sn3.5Ag0.5Cu and Sn3.9Ag0.6Cu alloys based on
JEDEC standard JESD22-A104. In order to save computational time and produce satisfactory results
in the region of interest, an independent more finely meshed so-called submodel scheme based on
cut-boundary displacement method is generated. The mesh density for different area ratio of
refinery/coarse model was verified and the results were found to be good agreement with previous
researches. The modified Coffin-Manson equation and strain energy density based equation are
applied to evaluate the reliability of SnAgCu alloys. A series of comprehensive parametric studies
were conducted in this paper.</description><identifier>ISSN: 0255-5476</identifier><identifier>ISSN: 1662-9752</identifier><identifier>EISSN: 1662-9752</identifier><identifier>DOI: 10.4028/www.scientific.net/MSF.594.175</identifier><language>eng</language><publisher>Trans Tech Publications Ltd</publisher><ispartof>Materials science forum, 2008-01, Vol.594, p.175-180</ispartof><rights>2008 Trans Tech Publications Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttps://www.scientific.net/Image/TitleCover/762?width=600</thumbnail><link.rule.ids>314,780,784,27923,27924</link.rule.ids></links><search><creatorcontrib>Lee, Hui Yu</creatorcontrib><creatorcontrib>Shieh, Wen Lo</creatorcontrib><creatorcontrib>Hsu, Hsiang Chen</creatorcontrib><title>Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading</title><title>Materials science forum</title><description>A three-dimensional finite element model of CMOS image sensor QFN packaging using
ANSYS codes is developed to investigate the solder joint reliability under thermal cycle test. The
predicted thermal-induced displacements were found to be very good agreement with the Moiré
interferometer experimental in-plane deformations. The developed finite element model is then
applied to predict fatigue life of Sn4.0Ag0.5Cu, Sn3.5Ag0.5Cu and Sn3.9Ag0.6Cu alloys based on
JEDEC standard JESD22-A104. In order to save computational time and produce satisfactory results
in the region of interest, an independent more finely meshed so-called submodel scheme based on
cut-boundary displacement method is generated. The mesh density for different area ratio of
refinery/coarse model was verified and the results were found to be good agreement with previous
researches. The modified Coffin-Manson equation and strain energy density based equation are
applied to evaluate the reliability of SnAgCu alloys. A series of comprehensive parametric studies
were conducted in this paper.</description><issn>0255-5476</issn><issn>1662-9752</issn><issn>1662-9752</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNqNkF1LwzAUhoMoOD_-Q6521y5pk37ciKM4HUynTu-EkKanWzRLNWkZ-_dGJnjr1QsvLw_nPAiNKYkZSYrJbreLvdJge91qFVvoJ_erWcxLFtOcH6ERzbIkKnOeHKMRSTiPOMuzU3Tm_TshKS1oNkJvz2C0rLXR_R53LV7Z6boa8NSYbu9x2zlc3S9XeL6Va8ArsD40T7MH_CjVx0812AYcftmA20qDq70y2q7xopNNyAt00krj4fI3z9Hr7OaluosWy9t5NV1EKimLPoKaZXmaEqaamhakzlWZ0VYxQsu84OFUUEnbEE55Tgm0MimzvKl5SRkwaGidnqPxgfvpuq8BfC-22iswRlroBi9STknCKAnDq8NQuc57B634dHor3V5QIn6kiiBV_EkVQaoIUkWQKoLUALg-AHonre9BbcR7Nzgbvvsv4hsenYgT</recordid><startdate>20080101</startdate><enddate>20080101</enddate><creator>Lee, Hui Yu</creator><creator>Shieh, Wen Lo</creator><creator>Hsu, Hsiang Chen</creator><general>Trans Tech Publications Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20080101</creationdate><title>Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading</title><author>Lee, Hui Yu ; Shieh, Wen Lo ; Hsu, Hsiang Chen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c298t-eb4673304cdb180b7c961fc4019785003ec2fd0515710efa2967db5914e4ed1b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lee, Hui Yu</creatorcontrib><creatorcontrib>Shieh, Wen Lo</creatorcontrib><creatorcontrib>Hsu, Hsiang Chen</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Materials science forum</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lee, Hui Yu</au><au>Shieh, Wen Lo</au><au>Hsu, Hsiang Chen</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading</atitle><jtitle>Materials science forum</jtitle><date>2008-01-01</date><risdate>2008</risdate><volume>594</volume><spage>175</spage><epage>180</epage><pages>175-180</pages><issn>0255-5476</issn><issn>1662-9752</issn><eissn>1662-9752</eissn><abstract>A three-dimensional finite element model of CMOS image sensor QFN packaging using
ANSYS codes is developed to investigate the solder joint reliability under thermal cycle test. The
predicted thermal-induced displacements were found to be very good agreement with the Moiré
interferometer experimental in-plane deformations. The developed finite element model is then
applied to predict fatigue life of Sn4.0Ag0.5Cu, Sn3.5Ag0.5Cu and Sn3.9Ag0.6Cu alloys based on
JEDEC standard JESD22-A104. In order to save computational time and produce satisfactory results
in the region of interest, an independent more finely meshed so-called submodel scheme based on
cut-boundary displacement method is generated. The mesh density for different area ratio of
refinery/coarse model was verified and the results were found to be good agreement with previous
researches. The modified Coffin-Manson equation and strain energy density based equation are
applied to evaluate the reliability of SnAgCu alloys. A series of comprehensive parametric studies
were conducted in this paper.</abstract><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/MSF.594.175</doi><tpages>6</tpages></addata></record> |
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| title | Reliability of SnAgCu Alloys for CMOS Image Sensor QFN Package under Thermal Cycling Loading |
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