Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios

This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly techn...

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Veröffentlicht in:	IEEE transactions on antennas and propagation 2009-10, Vol.57 (10), p.2842-2852
Hauptverfasser:	Zhang, Y.P., Sun, M., Chua, K.M., Wai, L.L., Duixian Liu
Format:	Artikel
Sprache:	eng
Schlagworte:	60-GHz radio Antenna in package (AiP) Antennas Arrays Assembly Bandwidth Ceramics Chips Design methodology Electronics packaging Frequency Impedance Inductors Interconnection Joining low-temperature cofired ceramic (LTCC) Millimeter wave technology Package design Radio Slot antennas Wireless communications
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