Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios
This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly techn...
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Veröffentlicht in: | IEEE transactions on antennas and propagation 2009-10, Vol.57 (10), p.2842-2852 |
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description | This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly technique. The antenna implemented in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic (LTCC) technology has achieved an acceptable impedance bandwidth from 59 to 65 GHz with an estimated efficiency of 94%. At millimeter-wave (mm-wave) frequency 60 GHz, one of key challenges is how to realize low-loss interconnection between a radio chip and an antenna using wire-bonding technique. This paper then addresses this issue in the framework of antenna-in-package (AiP) design at 60 GHz and proposes a new solution to the challenge. Detailed wirebond design method and results are given. A major concern with AiP is the risk of the antenna coupling to the radio chip. This paper also evaluates this unwanted coupling and shows that the coupling from the in-package antenna to the on-chip inductor is lower than 30 dB for the worst case. These results clearly demonstrate the feasibility and promise of the elegant AiP technology for emerging high-speed short-range 60-GHz wireless communications. |
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The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly technique. The antenna implemented in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic (LTCC) technology has achieved an acceptable impedance bandwidth from 59 to 65 GHz with an estimated efficiency of 94%. At millimeter-wave (mm-wave) frequency 60 GHz, one of key challenges is how to realize low-loss interconnection between a radio chip and an antenna using wire-bonding technique. This paper then addresses this issue in the framework of antenna-in-package (AiP) design at 60 GHz and proposes a new solution to the challenge. Detailed wirebond design method and results are given. A major concern with AiP is the risk of the antenna coupling to the radio chip. This paper also evaluates this unwanted coupling and shows that the coupling from the in-package antenna to the on-chip inductor is lower than 30 dB for the worst case. These results clearly demonstrate the feasibility and promise of the elegant AiP technology for emerging high-speed short-range 60-GHz wireless communications.</description><identifier>ISSN: 0018-926X</identifier><identifier>EISSN: 1558-2221</identifier><identifier>DOI: 10.1109/TAP.2009.2029290</identifier><identifier>CODEN: IETPAK</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>60-GHz radio ; Antenna in package (AiP) ; Antennas ; Arrays ; Assembly ; Bandwidth ; Ceramics ; Chips ; Design methodology ; Electronics packaging ; Frequency ; Impedance ; Inductors ; Interconnection ; Joining ; low-temperature cofired ceramic (LTCC) ; Millimeter wave technology ; Package design ; Radio ; Slot antennas ; Wireless communications</subject><ispartof>IEEE transactions on antennas and propagation, 2009-10, Vol.57 (10), p.2842-2852</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c428t-8f5bd9bb4ba668648e706cf633e1724e932907373c9e55db0eda39a6153b1b4e3</citedby><cites>FETCH-LOGICAL-c428t-8f5bd9bb4ba668648e706cf633e1724e932907373c9e55db0eda39a6153b1b4e3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5191068$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5191068$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Zhang, Y.P.</creatorcontrib><creatorcontrib>Sun, M.</creatorcontrib><creatorcontrib>Chua, K.M.</creatorcontrib><creatorcontrib>Wai, L.L.</creatorcontrib><creatorcontrib>Duixian Liu</creatorcontrib><title>Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios</title><title>IEEE transactions on antennas and propagation</title><addtitle>TAP</addtitle><description>This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly technique. The antenna implemented in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic (LTCC) technology has achieved an acceptable impedance bandwidth from 59 to 65 GHz with an estimated efficiency of 94%. At millimeter-wave (mm-wave) frequency 60 GHz, one of key challenges is how to realize low-loss interconnection between a radio chip and an antenna using wire-bonding technique. This paper then addresses this issue in the framework of antenna-in-package (AiP) design at 60 GHz and proposes a new solution to the challenge. Detailed wirebond design method and results are given. A major concern with AiP is the risk of the antenna coupling to the radio chip. This paper also evaluates this unwanted coupling and shows that the coupling from the in-package antenna to the on-chip inductor is lower than 30 dB for the worst case. These results clearly demonstrate the feasibility and promise of the elegant AiP technology for emerging high-speed short-range 60-GHz wireless communications.</description><subject>60-GHz radio</subject><subject>Antenna in package (AiP)</subject><subject>Antennas</subject><subject>Arrays</subject><subject>Assembly</subject><subject>Bandwidth</subject><subject>Ceramics</subject><subject>Chips</subject><subject>Design methodology</subject><subject>Electronics packaging</subject><subject>Frequency</subject><subject>Impedance</subject><subject>Inductors</subject><subject>Interconnection</subject><subject>Joining</subject><subject>low-temperature cofired ceramic (LTCC)</subject><subject>Millimeter wave technology</subject><subject>Package design</subject><subject>Radio</subject><subject>Slot antennas</subject><subject>Wireless communications</subject><issn>0018-926X</issn><issn>1558-2221</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp90U1PGzEQBmCraqWmae-VellxAC5LPf5a-xjxFSSkoiqI9mR5d2dT02CDvTnAr8chEQcOXMYa-ZmRRi8h34EeAVDzczG7OmKUmlKYYYZ-IBOQUteMMfhIJpSCrg1Tfz6TLznfllZoISbk7yyMGIKrfaivXPffLbE6weyXoRpiqm58wjaGvrooLHUxBOxGH0M1xmrul_9Wjy8_y-RG7CtF6_P5U_Xb9T7mr-TT4FYZv-3eKbk-O10cz-vLX-cXx7PLuhNMj7UeZNubthWtU0orobGhqhsU5wgNE2h4OabhDe8MStm3FHvHjVMgeQutQD4lB9u99yk-rDGP9s7nDlcrFzCus9WNpGWHMUXuvyu5pMC50QUevgtBNcAZE4wXuveG3sZ1CuVga4DxBiSDgugWdSnmnHCw98nfufRogdpNerakZzfp2V16ZeTHdsQj4iuXYIAqzZ8Bf3KTaQ</recordid><startdate>20091001</startdate><enddate>20091001</enddate><creator>Zhang, Y.P.</creator><creator>Sun, M.</creator><creator>Chua, K.M.</creator><creator>Wai, L.L.</creator><creator>Duixian Liu</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>7QQ</scope><scope>F28</scope><scope>FR3</scope><scope>JG9</scope></search><sort><creationdate>20091001</creationdate><title>Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios</title><author>Zhang, Y.P. ; Sun, M. ; Chua, K.M. ; Wai, L.L. ; Duixian Liu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c428t-8f5bd9bb4ba668648e706cf633e1724e932907373c9e55db0eda39a6153b1b4e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>60-GHz radio</topic><topic>Antenna in package (AiP)</topic><topic>Antennas</topic><topic>Arrays</topic><topic>Assembly</topic><topic>Bandwidth</topic><topic>Ceramics</topic><topic>Chips</topic><topic>Design methodology</topic><topic>Electronics packaging</topic><topic>Frequency</topic><topic>Impedance</topic><topic>Inductors</topic><topic>Interconnection</topic><topic>Joining</topic><topic>low-temperature cofired ceramic (LTCC)</topic><topic>Millimeter wave technology</topic><topic>Package design</topic><topic>Radio</topic><topic>Slot antennas</topic><topic>Wireless communications</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhang, Y.P.</creatorcontrib><creatorcontrib>Sun, M.</creatorcontrib><creatorcontrib>Chua, K.M.</creatorcontrib><creatorcontrib>Wai, L.L.</creatorcontrib><creatorcontrib>Duixian Liu</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005–Present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Ceramic Abstracts</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><jtitle>IEEE transactions on antennas and propagation</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Zhang, Y.P.</au><au>Sun, M.</au><au>Chua, K.M.</au><au>Wai, L.L.</au><au>Duixian Liu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios</atitle><jtitle>IEEE transactions on antennas and propagation</jtitle><stitle>TAP</stitle><date>2009-10-01</date><risdate>2009</risdate><volume>57</volume><issue>10</issue><spage>2842</spage><epage>2852</epage><pages>2842-2852</pages><issn>0018-926X</issn><eissn>1558-2221</eissn><coden>IETPAK</coden><abstract>This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly technique. The antenna implemented in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic (LTCC) technology has achieved an acceptable impedance bandwidth from 59 to 65 GHz with an estimated efficiency of 94%. At millimeter-wave (mm-wave) frequency 60 GHz, one of key challenges is how to realize low-loss interconnection between a radio chip and an antenna using wire-bonding technique. This paper then addresses this issue in the framework of antenna-in-package (AiP) design at 60 GHz and proposes a new solution to the challenge. Detailed wirebond design method and results are given. A major concern with AiP is the risk of the antenna coupling to the radio chip. This paper also evaluates this unwanted coupling and shows that the coupling from the in-package antenna to the on-chip inductor is lower than 30 dB for the worst case. These results clearly demonstrate the feasibility and promise of the elegant AiP technology for emerging high-speed short-range 60-GHz wireless communications.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TAP.2009.2029290</doi><tpages>11</tpages><oa>free_for_read</oa></addata></record> |
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subjects | 60-GHz radio Antenna in package (AiP) Antennas Arrays Assembly Bandwidth Ceramics Chips Design methodology Electronics packaging Frequency Impedance Inductors Interconnection Joining low-temperature cofired ceramic (LTCC) Millimeter wave technology Package design Radio Slot antennas Wireless communications |
title | Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios |
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