Effect of thermomechanical loads on the propagation of crack near the interface brittle/ductile

The purpose of this paper is to understand the combined effect of thermal and mechanical loading on the initiation and behaviour of sub-interface crack in the ceramic. In this study a 2D finite element model has been used to simulated mixed mode crack propagation near the bimaterial interface. The assembly ceramometalic is subjected simultaneously to thermomechanical stress field. The extent of a plastic zone deformation in the vicinity of the crack-tip has a significant influence on the rate of its propagation. The crack growth at the joint specimen under four-point bending (4PB) loading and the influence of residual stresses was also evaluated by the maximum tensile stress criterion. The J-integral at the crack tip is generally expressed by the thermomechanical local stresses. The results obtained show the effect of the temperature gradient Δ T, the size of the crack and the applied stresses on the J-integral.