High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL D)

A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film build-up process. The main characteristics of the laminate core substrate are the z-axis electrical connections, the abse...

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Bibliographische Detailangaben

Veröffentlicht in:	Microelectronics international 2001-12, Vol.18 (3), p.36-42
Hauptverfasser:	Beyne, Eric, Van Hoof, Rita, Webers, Tomas, Brebels, Steven, Rossi, Stéphanie, Lechleiter, François, Di Ianni, Marianna, Ostmann, Andreas
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Copper Curing Electronics Exact sciences and technology Interconnect Lasers Microelectronic fabrication (materials and surfaces technology) Microelectronics Photofinishing laboratories Plating Printed circuit boards Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Studies Thin films
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