Characterization of phosphate electrolytes for use in Cu electrochemical mechanical planarization

Characterization of phosphate electrolytes for use in Cu electrochemical mechanical planarization

Electrochemical mechanical planarization (ECMP) is a potential replacement or complement to conventional chemical mechanical planarization (CMP) techniques. ECMP can operate at very low downforces (

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Bibliographische Detailangaben
Veröffentlicht in:Electrochimica acta 2008-11, Vol.53 (28), p.8211-8216
Hauptverfasser: Shattuck, Kristin G., Lin, Jeng-Yu, Cojocaru, Paula, West, Alan C.
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
BTA
Copper
ECMP
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Planarization
Potassium phosphate
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Beschreibung
Zusammenfassung:Electrochemical mechanical planarization (ECMP) is a potential replacement or complement to conventional chemical mechanical planarization (CMP) techniques. ECMP can operate at very low downforces (
ISSN:0013-4686
1873-3859
DOI:10.1016/j.electacta.2008.05.077