Intermediate band mobility in heavily titanium-doped silicon layers
The sheet resistance and the Hall mobility of high-purity Si wafers, in whose surface Ti atoms are implanted and laser annealed reaching concentrations above 10 21 cm −3, are measured in the 90–370 K range. Below 240 K, an unconventional behavior is observed that is well explained on the basis of th...
Gespeichert in:
Veröffentlicht in: | Solar energy materials and solar cells 2009-09, Vol.93 (9), p.1668-1673 |
---|---|
Hauptverfasser: | , , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The sheet resistance and the Hall mobility of high-purity Si wafers, in whose surface Ti atoms are implanted and laser annealed reaching concentrations above 10
21
cm
−3, are measured in the 90–370
K range. Below 240
K, an unconventional behavior is observed that is well explained on the basis of the appearance of an intermediate band (IB) region able to form a blocking junction with the substrate and of the appearance of an IB conduction. Explanations based on ordinary device physics fail to justify all the unconventional behavior of the characteristics observed. |
---|---|
ISSN: | 0927-0248 1879-3398 |
DOI: | 10.1016/j.solmat.2009.05.014 |