Effect of the Additives in the Electrolyte on the Physical Property of the Electrodeposited Copper

Effect of the Additives in the Electrolyte on the Physical Property of the Electrodeposited Copper

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Veröffentlicht in:Hyōmen gijutsu 2009/06/01, Vol.60(6), pp.413-413
Hauptverfasser: MATSUDA, Mitsuyoshi, TAKAHASHI, Takuya, YOSHIHARA, Sachio, DOBASHI, Makoto
Format: Artikel
Sprache:eng ; jpn
Schlagworte:
Electrodeposition of Copper
Grain Growth
Impurity
Tensile Strength
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container_title Hyōmen gijutsu
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creator MATSUDA, Mitsuyoshi
TAKAHASHI, Takuya
YOSHIHARA, Sachio
DOBASHI, Makoto
description
doi_str_mv 10.4139/sfj.60.413
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ispartof Journal of The Surface Finishing Society of Japan, 2009/06/01, Vol.60(6), pp.413-413
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source J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese; EZB-FREE-00999 freely available EZB journals
subjects Electrodeposition of Copper
Grain Growth
Impurity
Tensile Strength
title Effect of the Additives in the Electrolyte on the Physical Property of the Electrodeposited Copper
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