A S-Bridged Inductive Electromagnetic Bandgap Power Plane for Suppression of Ground Bounce Noise

In this letter, a novel power plane using an inductive S-bridged electromagnetic bandgap (EBG) is proposed for ultra wideband suppression of the ground bounce noise. The S-shaped bridge detouring unit cells effectively increase the power plane inductance. -30 dB stopband is realized from 220 MHz to...

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Veröffentlicht in:	IEEE microwave and wireless components letters 2007-10, Vol.17 (10), p.709-711
Hauptverfasser:	JOO, Sung-Ho, KIM, Dong-Yeop, LEE, Hai-Young
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Bridge circuits Capacitors Circuit noise Decoupling Dielectric, amorphous and glass solid devices Electromagnetic bandgap (EBG) structure Electromagnetic compatibility Electromagnetic interference electromagnetic interference (EMI) Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Frequency ground bounce noise (GBN) Grounds high-speed digital circuits Inductance Information, signal and communications theory Materials Metamaterials Microwaves Noise Noise levels Periodic structures Photonic band gap Planes power distribution system (PDS) Resonance Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Telecommunications and information theory Ultrawideband
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Beschreibung
Zusammenfassung:	In this letter, a novel power plane using an inductive S-bridged electromagnetic bandgap (EBG) is proposed for ultra wideband suppression of the ground bounce noise. The S-shaped bridge detouring unit cells effectively increase the power plane inductance. -30 dB stopband is realized from 220 MHz to 7 GHz. The stopband lower limit (220 MHz) of the proposed EBG has been greatly reduced from that (550 MHz) of L-bridged EBG. It is expected that the number of local decoupling capacitors for the power plane integrity is reduced using the proposed S-bridged EBG without the self resonance effect.
ISSN:	1531-1309 2771-957X 1558-1764 2771-9588
DOI:	10.1109/LMWC.2007.905604