Improvement of Interpoly Dielectric Characteristics by Plasma Nitridation and Oxidation for Future @@inand@ Flash Memory

In this letter, plasma nitridation and oxidation on interpoly dielectric (IPD; SiO@@d2@-SiN-SiO@@d2@ ) for cell programming speed and reliabilities are investigated. Nitrided top oxide with N@@d2@ plasma shows excellent physical and electrical properties in terms of edge profile on IPD and fast prog...

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Veröffentlicht in:IEEE electron device letters 2008-11, Vol.29 (11), p.1199-1202
Hauptverfasser: Ho, Ching Yuan, Lien, Chenhsin, Sakamoto, Y, Yang, Ru Jye, Fijita, H, Liu, C H, Lin, Y M, Pittikoun, S, Aritome, S
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Sprache:eng
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Zusammenfassung:In this letter, plasma nitridation and oxidation on interpoly dielectric (IPD; SiO@@d2@-SiN-SiO@@d2@ ) for cell programming speed and reliabilities are investigated. Nitrided top oxide with N@@d2@ plasma shows excellent physical and electrical properties in terms of edge profile on IPD and fast programming voltage. However, plasma nitridation on a floating gate suffers from data retention problems that result from nitridelike residue along the word line. A method to densify and reoxidize bottom oxide with O@@d2@ plasma oxidation is proposed for leakage path inhibition and data retention improvement.
ISSN:0741-3106
DOI:10.1109/LED.2008.2004972