Development of a titanium plasma etch process for uncooled titanium nanobolometer fabrication

In this paper, we present our development of a BCl 3/Cl 2 plasma etch for defining nanoscale titanium (Ti) features using a LAM Research 9600 metal plasma etch chamber. The nanoscale Ti plasma etch is used, for the first time, to define Ti nanobolometer sensor features used in a novel IR sensor proc...

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Veröffentlicht in:Microelectronic engineering 2009-04, Vol.86 (4), p.971-975
Hauptverfasser: Gilmartin, Stephen F., Arshak, Khalil, Bain, Dave, Lane, William A., Collins, Damian, Arshak, Arousian, McCarthy, Brendan, Newcomb, Simon B., Walsh, Michelle
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Sprache:eng
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Zusammenfassung:In this paper, we present our development of a BCl 3/Cl 2 plasma etch for defining nanoscale titanium (Ti) features using a LAM Research 9600 metal plasma etch chamber. The nanoscale Ti plasma etch is used, for the first time, to define Ti nanobolometer sensor features used in a novel IR sensor process. We characterised the nanoscale etch in terms of five primary process parameters using a 16-run V fractional factorial experiment, to provide good estimates of all main effects and two-factor interactions. The experimental results determined the target levels for the etch process parameters. Our optimised nanoscale Ti etch module was then integrated within a CMOS/MEMs-compatible nanobolometer infrared (IR) sensor fabrication flow.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2009.02.009