Deep Submicron CMOS for Millimeter Wave Power Applications
This letter gives an early assessment of deep submicron planar bulk CMOS devices for millimeter wave power amplifier (PA) applications. Using load pull measurements, a record high power density of 100 mW/mm and a transducer gain of 7 dB at 35 GHz were achieved for a 40 nm physical gate length CMOS d...
Gespeichert in:
Veröffentlicht in: | IEEE microwave and wireless components letters 2008-05, Vol.18 (5), p.329-331 |
---|---|
Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | This letter gives an early assessment of deep submicron planar bulk CMOS devices for millimeter wave power amplifier (PA) applications. Using load pull measurements, a record high power density of 100 mW/mm and a transducer gain of 7 dB at 35 GHz were achieved for a 40 nm physical gate length CMOS device with a total gate width of 192 mum. Furthermore a peak PAE of 33% was reached. This shows that 40 nm gate length CMOS is feasible for medium PAs in the millimeter wave region. |
---|---|
ISSN: | 1531-1309 2771-957X 1558-1764 2771-9588 |
DOI: | 10.1109/LMWC.2008.922122 |