Advanced simulations of copper layer thickness distribution on printed circuit boards
The printed circuit board (PCB) industry is constantly being pushed toward ongoing miniaturization, shorter delivery times, and smaller operational margins. This means manufacturers are forced to produce more complex products in shorter times, with lower costs, and at higher specifications.
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| Veröffentlicht in: | Metal finishing 2009-03, Vol.107 (3), p.27-29 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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| Zusammenfassung: | The printed circuit board (PCB) industry is constantly being pushed toward ongoing miniaturization, shorter delivery times, and smaller operational margins. This means manufacturers are forced to produce more complex products in shorter times, with lower costs, and at higher specifications. |
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| ISSN: | 0026-0576 1873-4057 |
| DOI: | 10.1016/S0026-0576(09)80047-0 |