Current spreading, heat transfer, and light extraction in multi-pixel LED array

Using simulation, we have investigated into the current spreading, heat transfer, and light emission in a high‐power light‐emitting diode (LED) with an interdigitated multipixel array (IMPA) chip design. The main advantages of such LEDs compared with conventional square‐shaped ones, like a lower series resistance and a higher emission efficiency at high currents, are interpreted in terms of current spreading and local active region overheating originated from the current crowding typical for planar LED dice. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)