Direct Adhesion of Silicone Rubber to Resins During Peroxide Curing Using Molecular Adhesive

A new concept has been proposed for adhesion theory and technology, unifying various adhesion theories and simplifying adhesion technology. This purpose is achieved by using a molecular adhesive, 6-(3-triethoxysilylpropy-lamino)-1, 3, 5-triazine-2, 4-dithiol (TES), which contains two functional groups of dithiol triazinyl and alkoxysilyl groups in one molecule. Resins such as epoxy resin, polyamide, and polyester were pretreated by corona discharge to form OH groups on the surfaces. The OH groups react readily with TES by heating for 10min at 150°C to give TES containing resin surfaces. Silicone rubber adhered readily to the TES containing resin surfaces by hot-pressing for 10min at 160°C, with very high peel strength which is destroyed in rubber-phase. Peel strength decreased with surface roughness on resins, and the amount of TES decreased with the roughness.