Bonding Low-density Nanoporous Metal Foams Using Sputtered Solder

Bonding Low-density Nanoporous Metal Foams Using Sputtered Solder

A method has been developed to bond low‐density nanoporous copper foam components to an aluminum substrate using solder that is sputtered onto the surfaces. After assembling the components together and heating them to melt the solder, they were joined together by a layer of solder with a thickness o...

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Veröffentlicht in:Advanced engineering materials 2008-02, Vol.10 (1-2), p.51-55
Hauptverfasser: Bono, M. J., Cervantes, O., Akaba, C. M., Hamza, A. V., Foreman, R. J., Teslich, N. E.
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Bonding
Cellular metals
Exact sciences and technology
Metals. Metallurgy
Powder metallurgy. Composite materials
Production techniques
Sputtering
Technology
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Beschreibung
Zusammenfassung:A method has been developed to bond low‐density nanoporous copper foam components to an aluminum substrate using solder that is sputtered onto the surfaces. After assembling the components together and heating them to melt the solder, they were joined together by a layer of solder with a thickness of less than 2 μm.
ISSN:1438-1656
1527-2648
DOI:10.1002/adem.200700239