Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability
The evolution of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and its effects on bonding reliability were studied. Results show that volume shrinkage resulted in void formation during multi-reflow, while the Kirkendall effect led to void formation during...
Gespeichert in:
| Veröffentlicht in: | Journal of electronic materials 2008-03, Vol.37 (3), p.307-313 |
|---|---|
| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 313 |
|---|---|
| container_issue | 3 |
| container_start_page | 307 |
| container_title | Journal of electronic materials |
| container_volume | 37 |
| creator | Lin, Xiaoqin Luo, Le |
| description | The evolution of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and its effects on bonding reliability were studied. Results show that volume shrinkage resulted in void formation during multi-reflow, while the Kirkendall effect led to void formation during aging. A thick
η
-phase and voids at the boundaries among Cu
6
Sn
5
grains promoted the void growth in the
ε
-phase. Though the formation of voids had a trivial weakening effect on the shear strength of the solder joints, the voids were a threat to the bonding reliability of solder bumps. |
| doi_str_mv | 10.1007/s11664-007-0359-2 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_31910030</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>31910030</sourcerecordid><originalsourceid>FETCH-LOGICAL-c442t-aafc0db462ca66100d525bdd3510aff9f9e3e630926c07f2d5279fa816fb82543</originalsourceid><addsrcrecordid>eNp1UU2LFDEQDeKC464_wFsQ9BbNRyfTfZxdxlXYRXBUvIV0PoYsmWRMutX991vNLAqCp3pUvXq8qofQS0bfMkrX7xpjSnUEIKFCDoQ_QSsmO0FYr74_RSsqFCOSC_kMPW_tjlImWc9W6Pe3Eh3e_ixpnmLJOGa8m0cCmuQ22gqdXSabPd6V5HzFl_Ph2LCba8x7fDunKZLqQyq_sMkOb_ZLe0FxangbgrdQQeOyZLeMPvsUzRhTnO4v0FkwqfkXj_UcfX2__XL1gdx8uv54tbkhtuv4RIwJlrqxU9wapcCWk1yOzgnJqAlhCIMXXgk6cGXpOnAYr4dgeqbC2HN4wDl6c9I91vJj9m3Sh9isT8lkX-amBRtAVVAgvvqHeFfmmsGb5rTru44JBSR2IsFrWoPT9bHGg6n3mlG9BKFPQegFLkFoDjuvH4VNsyaFarKN7c8ipxAEXUvg8ROvHZf3-vrXwP_FHwB4SZbo</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>204844136</pqid></control><display><type>article</type><title>Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability</title><source>SpringerLink Journals - AutoHoldings</source><creator>Lin, Xiaoqin ; Luo, Le</creator><creatorcontrib>Lin, Xiaoqin ; Luo, Le</creatorcontrib><description>The evolution of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and its effects on bonding reliability were studied. Results show that volume shrinkage resulted in void formation during multi-reflow, while the Kirkendall effect led to void formation during aging. A thick
η
-phase and voids at the boundaries among Cu
6
Sn
5
grains promoted the void growth in the
ε
-phase. Though the formation of voids had a trivial weakening effect on the shear strength of the solder joints, the voids were a threat to the bonding reliability of solder bumps.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-007-0359-2</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Applied sciences ; Brazing. Soldering ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Electronics ; Electronics and Microelectronics ; Exact sciences and technology ; Instrumentation ; Interfacial bonding ; Intermetallic compounds ; Joining, thermal cutting: metallurgical aspects ; Lead free solders ; Materials ; Materials Science ; Metals. Metallurgy ; Optical and Electronic Materials ; Shear tests ; Solid State Physics</subject><ispartof>Journal of electronic materials, 2008-03, Vol.37 (3), p.307-313</ispartof><rights>TMS 2007</rights><rights>2008 INIST-CNRS</rights><rights>Copyright Minerals, Metals & Materials Society Mar 2008</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c442t-aafc0db462ca66100d525bdd3510aff9f9e3e630926c07f2d5279fa816fb82543</citedby><cites>FETCH-LOGICAL-c442t-aafc0db462ca66100d525bdd3510aff9f9e3e630926c07f2d5279fa816fb82543</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-007-0359-2$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-007-0359-2$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=20181075$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Lin, Xiaoqin</creatorcontrib><creatorcontrib>Luo, Le</creatorcontrib><title>Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>The evolution of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and its effects on bonding reliability were studied. Results show that volume shrinkage resulted in void formation during multi-reflow, while the Kirkendall effect led to void formation during aging. A thick
η
-phase and voids at the boundaries among Cu
6
Sn
5
grains promoted the void growth in the
ε
-phase. Though the formation of voids had a trivial weakening effect on the shear strength of the solder joints, the voids were a threat to the bonding reliability of solder bumps.</description><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Electronics</subject><subject>Electronics and Microelectronics</subject><subject>Exact sciences and technology</subject><subject>Instrumentation</subject><subject>Interfacial bonding</subject><subject>Intermetallic compounds</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Lead free solders</subject><subject>Materials</subject><subject>Materials Science</subject><subject>Metals. Metallurgy</subject><subject>Optical and Electronic Materials</subject><subject>Shear tests</subject><subject>Solid State Physics</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>BENPR</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1UU2LFDEQDeKC464_wFsQ9BbNRyfTfZxdxlXYRXBUvIV0PoYsmWRMutX991vNLAqCp3pUvXq8qofQS0bfMkrX7xpjSnUEIKFCDoQ_QSsmO0FYr74_RSsqFCOSC_kMPW_tjlImWc9W6Pe3Eh3e_ixpnmLJOGa8m0cCmuQ22gqdXSabPd6V5HzFl_Ph2LCba8x7fDunKZLqQyq_sMkOb_ZLe0FxangbgrdQQeOyZLeMPvsUzRhTnO4v0FkwqfkXj_UcfX2__XL1gdx8uv54tbkhtuv4RIwJlrqxU9wapcCWk1yOzgnJqAlhCIMXXgk6cGXpOnAYr4dgeqbC2HN4wDl6c9I91vJj9m3Sh9isT8lkX-amBRtAVVAgvvqHeFfmmsGb5rTru44JBSR2IsFrWoPT9bHGg6n3mlG9BKFPQegFLkFoDjuvH4VNsyaFarKN7c8ipxAEXUvg8ROvHZf3-vrXwP_FHwB4SZbo</recordid><startdate>20080301</startdate><enddate>20080301</enddate><creator>Lin, Xiaoqin</creator><creator>Luo, Le</creator><general>Springer US</general><general>Institute of Electrical and Electronics Engineers</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope><scope>7QQ</scope><scope>7SP</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20080301</creationdate><title>Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability</title><author>Lin, Xiaoqin ; Luo, Le</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c442t-aafc0db462ca66100d525bdd3510aff9f9e3e630926c07f2d5279fa816fb82543</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Applied sciences</topic><topic>Brazing. Soldering</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Electronics</topic><topic>Electronics and Microelectronics</topic><topic>Exact sciences and technology</topic><topic>Instrumentation</topic><topic>Interfacial bonding</topic><topic>Intermetallic compounds</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Lead free solders</topic><topic>Materials</topic><topic>Materials Science</topic><topic>Metals. Metallurgy</topic><topic>Optical and Electronic Materials</topic><topic>Shear tests</topic><topic>Solid State Physics</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lin, Xiaoqin</creatorcontrib><creatorcontrib>Luo, Le</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><collection>Ceramic Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lin, Xiaoqin</au><au>Luo, Le</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2008-03-01</date><risdate>2008</risdate><volume>37</volume><issue>3</issue><spage>307</spage><epage>313</epage><pages>307-313</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>The evolution of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and its effects on bonding reliability were studied. Results show that volume shrinkage resulted in void formation during multi-reflow, while the Kirkendall effect led to void formation during aging. A thick
η
-phase and voids at the boundaries among Cu
6
Sn
5
grains promoted the void growth in the
ε
-phase. Though the formation of voids had a trivial weakening effect on the shear strength of the solder joints, the voids were a threat to the bonding reliability of solder bumps.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11664-007-0359-2</doi><tpages>7</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0361-5235 |
| ispartof | Journal of electronic materials, 2008-03, Vol.37 (3), p.307-313 |
| issn | 0361-5235 1543-186X |
| language | eng |
| recordid | cdi_proquest_miscellaneous_31910030 |
| source | SpringerLink Journals - AutoHoldings |
| subjects | Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Electronics Electronics and Microelectronics Exact sciences and technology Instrumentation Interfacial bonding Intermetallic compounds Joining, thermal cutting: metallurgical aspects Lead free solders Materials Materials Science Metals. Metallurgy Optical and Electronic Materials Shear tests Solid State Physics |
| title | Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T18%3A09%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Void%20Evolution%20in%20Sub-100-Micron%20Sn-Ag%20Solder%20Bumps%20during%20Multi-reflow%20and%20Aging%20and%20its%20Effects%20on%20Bonding%20Reliability&rft.jtitle=Journal%20of%20electronic%20materials&rft.au=Lin,%20Xiaoqin&rft.date=2008-03-01&rft.volume=37&rft.issue=3&rft.spage=307&rft.epage=313&rft.pages=307-313&rft.issn=0361-5235&rft.eissn=1543-186X&rft.coden=JECMA5&rft_id=info:doi/10.1007/s11664-007-0359-2&rft_dat=%3Cproquest_cross%3E31910030%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=204844136&rft_id=info:pmid/&rfr_iscdi=true |