Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability

The evolution of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and its effects on bonding reliability were studied. Results show that volume shrinkage resulted in void formation during multi-reflow, while the Kirkendall effect led to void formation during...

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Veröffentlicht in:	Journal of electronic materials 2008-03, Vol.37 (3), p.307-313
Hauptverfasser:	Lin, Xiaoqin, Luo, Le
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemistry and Materials Science Electronics Electronics and Microelectronics Exact sciences and technology Instrumentation Interfacial bonding Intermetallic compounds Joining, thermal cutting: metallurgical aspects Lead free solders Materials Materials Science Metals. Metallurgy Optical and Electronic Materials Shear tests Solid State Physics
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Zusammenfassung:	The evolution of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and its effects on bonding reliability were studied. Results show that volume shrinkage resulted in void formation during multi-reflow, while the Kirkendall effect led to void formation during aging. A thick η -phase and voids at the boundaries among Cu 6 Sn 5 grains promoted the void growth in the ε -phase. Though the formation of voids had a trivial weakening effect on the shear strength of the solder joints, the voids were a threat to the bonding reliability of solder bumps.
ISSN:	0361-5235 1543-186X
DOI:	10.1007/s11664-007-0359-2