Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification
Patterned gold microstructures were fabricated on a polymer substrate by a novel method involving selective electroless plating and microcontact printing. The micro-sized gold patterns were made by the site-selective chemical modification of polyimide substrate films using aqueous potassium hydroxid...
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| Veröffentlicht in: | Microelectronic engineering 2008, Vol.85 (1), p.136-142 |
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| container_title | Microelectronic engineering |
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| creator | Yoon, S.S. Kim, D.O. Park, S.C. Lee, Y.K. Chae, H.Y. Jung, S.B. Nam, J.-D. |
| description | Patterned gold microstructures were fabricated on a polymer substrate by a novel method involving selective electroless plating and microcontact printing. The micro-sized gold patterns were made by the site-selective chemical modification of polyimide substrate films using aqueous potassium hydroxide solution and microcontact printing with a pitch size in the range of 20–200
μm. The base-treated area of the polyimide film became hydrophilic in the regions where the ion-exchange reactions took place for the subsequent metallization. The hydrophilic patterns were sensitized by placing the film in a solution of PdCl
2 and, subsequently, the activated substrate was immersed in an electroless plating solution of Ni and Au to provide well-developed gold patterns on polyimide substrate films. |
| doi_str_mv | 10.1016/j.mee.2007.04.142 |
| format | Article |
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μm. The base-treated area of the polyimide film became hydrophilic in the regions where the ion-exchange reactions took place for the subsequent metallization. The hydrophilic patterns were sensitized by placing the film in a solution of PdCl
2 and, subsequently, the activated substrate was immersed in an electroless plating solution of Ni and Au to provide well-developed gold patterns on polyimide substrate films.</description><identifier>ISSN: 0167-9317</identifier><identifier>EISSN: 1873-5568</identifier><identifier>DOI: 10.1016/j.mee.2007.04.142</identifier><identifier>CODEN: MIENEF</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Applied sciences ; Electroless plating ; Electronics ; Exact sciences and technology ; Gold ; Microcontact printing ; Microelectronic fabrication (materials and surfaces technology) ; Polyimide film ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><ispartof>Microelectronic engineering, 2008, Vol.85 (1), p.136-142</ispartof><rights>2007 Elsevier B.V.</rights><rights>2008 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c424t-4b336a4ace56136fb8b1615735d9060cc0b0220153c96b747a7e55ae966e40953</citedby><cites>FETCH-LOGICAL-c424t-4b336a4ace56136fb8b1615735d9060cc0b0220153c96b747a7e55ae966e40953</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0167931707005199$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,4010,27900,27901,27902,65534</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=19977006$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Yoon, S.S.</creatorcontrib><creatorcontrib>Kim, D.O.</creatorcontrib><creatorcontrib>Park, S.C.</creatorcontrib><creatorcontrib>Lee, Y.K.</creatorcontrib><creatorcontrib>Chae, H.Y.</creatorcontrib><creatorcontrib>Jung, S.B.</creatorcontrib><creatorcontrib>Nam, J.-D.</creatorcontrib><title>Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification</title><title>Microelectronic engineering</title><description>Patterned gold microstructures were fabricated on a polymer substrate by a novel method involving selective electroless plating and microcontact printing. The micro-sized gold patterns were made by the site-selective chemical modification of polyimide substrate films using aqueous potassium hydroxide solution and microcontact printing with a pitch size in the range of 20–200
μm. The base-treated area of the polyimide film became hydrophilic in the regions where the ion-exchange reactions took place for the subsequent metallization. The hydrophilic patterns were sensitized by placing the film in a solution of PdCl
2 and, subsequently, the activated substrate was immersed in an electroless plating solution of Ni and Au to provide well-developed gold patterns on polyimide substrate films.</description><subject>Applied sciences</subject><subject>Electroless plating</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Gold</subject><subject>Microcontact printing</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Polyimide film</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><issn>0167-9317</issn><issn>1873-5568</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNp9kM1uFDEQhC0EEkvIA3DzBW4zaY__dsQJBUiQInEhZ8vj6Ym88tiL7Y1Ynh5vNlJunFrdqqpWfYR8YNAzYOpq16-I_QCgexA9E8MrsmFbzTsp1fY12TSN7kbO9FvyrpQdtF3AdkP-fPUZXaUrVhuC_2urT5GmhT6kMNO9rRVzLLTd9ikc_epnpOUwlZptRTod6epdTi7FalvKPvtYfXygNs60YGjJ_vFkyIt1SNc0-8W7px_vyZvFhoKXz_OC3H__9uv6trv7efPj-std58QgaicmzpUVzS0V42qZthNTTGou5xEUOAcTDAMwyd2oJi201SilxVEpFDBKfkE-nXP3Of0-YKlm9cVhCDZiOhTTkPBRCN6E7CxsfUrJuJjWZrX5aBiYE2OzM42xOTE2IExj3Dwfn8NtcTYs2Ubny4txHLUGUE33-azD1vTRYzbFeYwO5yf6Zk7-P1_-Afl_k4w</recordid><startdate>2008</startdate><enddate>2008</enddate><creator>Yoon, S.S.</creator><creator>Kim, D.O.</creator><creator>Park, S.C.</creator><creator>Lee, Y.K.</creator><creator>Chae, H.Y.</creator><creator>Jung, S.B.</creator><creator>Nam, J.-D.</creator><general>Elsevier B.V</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>2008</creationdate><title>Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification</title><author>Yoon, S.S. ; Kim, D.O. ; Park, S.C. ; Lee, Y.K. ; Chae, H.Y. ; Jung, S.B. ; Nam, J.-D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c424t-4b336a4ace56136fb8b1615735d9060cc0b0220153c96b747a7e55ae966e40953</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Applied sciences</topic><topic>Electroless plating</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Gold</topic><topic>Microcontact printing</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Polyimide film</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yoon, S.S.</creatorcontrib><creatorcontrib>Kim, D.O.</creatorcontrib><creatorcontrib>Park, S.C.</creatorcontrib><creatorcontrib>Lee, Y.K.</creatorcontrib><creatorcontrib>Chae, H.Y.</creatorcontrib><creatorcontrib>Jung, S.B.</creatorcontrib><creatorcontrib>Nam, J.-D.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronic engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yoon, S.S.</au><au>Kim, D.O.</au><au>Park, S.C.</au><au>Lee, Y.K.</au><au>Chae, H.Y.</au><au>Jung, S.B.</au><au>Nam, J.-D.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification</atitle><jtitle>Microelectronic engineering</jtitle><date>2008</date><risdate>2008</risdate><volume>85</volume><issue>1</issue><spage>136</spage><epage>142</epage><pages>136-142</pages><issn>0167-9317</issn><eissn>1873-5568</eissn><coden>MIENEF</coden><abstract>Patterned gold microstructures were fabricated on a polymer substrate by a novel method involving selective electroless plating and microcontact printing. The micro-sized gold patterns were made by the site-selective chemical modification of polyimide substrate films using aqueous potassium hydroxide solution and microcontact printing with a pitch size in the range of 20–200
μm. The base-treated area of the polyimide film became hydrophilic in the regions where the ion-exchange reactions took place for the subsequent metallization. The hydrophilic patterns were sensitized by placing the film in a solution of PdCl
2 and, subsequently, the activated substrate was immersed in an electroless plating solution of Ni and Au to provide well-developed gold patterns on polyimide substrate films.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.mee.2007.04.142</doi><tpages>7</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0167-9317 |
| ispartof | Microelectronic engineering, 2008, Vol.85 (1), p.136-142 |
| issn | 0167-9317 1873-5568 |
| language | eng |
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| source | Elsevier ScienceDirect Journals |
| subjects | Applied sciences Electroless plating Electronics Exact sciences and technology Gold Microcontact printing Microelectronic fabrication (materials and surfaces technology) Polyimide film Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
| title | Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification |
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