Controlled Loading of Nanoparticles into Submicrometer Holes

Controlled Loading of Nanoparticles into Submicrometer Holes

Controlled nanoparticle loading into submicron holes is driven by electrostatic interparticle and particle‐hole interactions. The average number of trapped nanoparticles increases with the ionic strength of the suspending medium (left). The relative particle‐hole sizes determine the average number o...

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Veröffentlicht in:Advanced materials (Weinheim) 2008-02, Vol.20 (3), p.535-538
Hauptverfasser: Mirin, N. A., Hainey Jr, M., Halas, N. J.
Format: Artikel
Sprache:eng
Schlagworte:
Assembly
Lithography
Nanoparticles
Patterning
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Beschreibung
Zusammenfassung:Controlled nanoparticle loading into submicron holes is driven by electrostatic interparticle and particle‐hole interactions. The average number of trapped nanoparticles increases with the ionic strength of the suspending medium (left). The relative particle‐hole sizes determine the average number of trapped metal nanoparticles (right).
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.200701442