The technical potential of a sous-vide processing method for developing high-moisture textured soy protein

[Display omitted] •The sous-vide process could produce meat analogues with high moisture content.•Sous-vide treatment reduced the textural properties of texturized soy protein (TSP).•Sous-vide treatment increased bond quantity, excluding ionic bonds.•The number of β-sheet and α-helix bands was incre...

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Veröffentlicht in:Food chemistry 2024-01, Vol.430, p.136978-136978, Article 136978
Hauptverfasser: Woo Choi, Hyun, Choi, Minji, Hahn, Jungwoo, Jin Choi, Young
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Sprache:eng
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Zusammenfassung:[Display omitted] •The sous-vide process could produce meat analogues with high moisture content.•Sous-vide treatment reduced the textural properties of texturized soy protein (TSP).•Sous-vide treatment increased bond quantity, excluding ionic bonds.•The number of β-sheet and α-helix bands was increased in the secondary structure.•Sous-vide processing could mimic the meat through precise control of the microstructure. This study explored the potential of sous-vide processing as a novel technique for transforming low-moisture textured soy protein (TSP) into a product with high moisture content and texture comparable to meat. We hypothesized that the sous-vide treatment would enable precise control of the TSP microstructure. In the ensuing process, the TSP maintained the moisture content at approximately 70% and changed color towards darker tones. Additionally, the porous microstructure changed, transitioning from a large to a smaller air layer. As the treatment continued, both the hardness and texturization index of the TSP were reduced. Furthermore, the secondary structure of the protein exhibited an increase in β-sheet and α-helix structures, indicating enhanced hydrogen bonds, hydrophobic interactions, and disulfide bonds. Optimally, a sample with 24 h at 90℃ displayed textural characteristics similar to chicken breast. The investigation underlines the sous-vide method as a revolutionary technique yielding high-moisture content and improved texture for TSP.
ISSN:0308-8146
1873-7072
DOI:10.1016/j.foodchem.2023.136978