Biomass-based carbon aerogel/Fe3O4@PEG phase change composites with satisfactory electromagnetic interference shielding and multi-source driven thermal management in thermal energy storage

[Display omitted] •Biomass carbon aerogel-based PCM composite with high conductivity (281.1 S/m) is prepared.•High PCM loading ratio and melting enthalpy of LGP reach 97.5 % and 156.32 J/g.•LGP shows a satisfactory EMI SE (up to 52.83 dB) with adding of Fe3O4.•Efficient multi-source driven thermal m...

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Veröffentlicht in:Composites. Part A, Applied science and manufacturing Applied science and manufacturing, 2022-12, Vol.163, p.107248, Article 107248
Hauptverfasser: Shen, Rongbiao, Weng, Mengman, Zhang, Li, Huang, Jintao, Sheng, Xinxin
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Sprache:eng
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Zusammenfassung:[Display omitted] •Biomass carbon aerogel-based PCM composite with high conductivity (281.1 S/m) is prepared.•High PCM loading ratio and melting enthalpy of LGP reach 97.5 % and 156.32 J/g.•LGP shows a satisfactory EMI SE (up to 52.83 dB) with adding of Fe3O4.•Efficient multi-source driven thermal management of LGP is achieved. The development of multifunctional materials to eliminate electromagnetic wave interference (EMI) and achieve multi-source driven thermal management for electronic devices has become a consensus. In this work, biomass-based carbon aerogels (LG) were prepared and used as porous supporting material to encapsulate magnetic Fe3O4@polyethylene glycol (Fe3O4@PEG) by vacuum impregnation. Form-stable LG-based phase change composites (LGP) were obtained, which had excellent thermal storage capability and satisfactory EMI shielding effectiveness (SE). With the supporting and bridging effects of GO, LGP-3–0 % has a high latent heat enthalpy of 156.32 J/g and excellent electrical conductivity of 281.1 S/m. With addition of 7 wt% Fe3O4, LGP-3–7 % achieves satisfactory EMI SE of 53.83 dB. Furthermore, LGP-3–7 % exhibits an outstanding performance of multi-source driven thermal management, including light-to-thermal, magnetic-to-thermal, and electro-to-thermal conversion. In short, LGP show the wide application prospects for electronic device to avoid EMI and achieve thermal management.
ISSN:1359-835X
1878-5840
DOI:10.1016/j.compositesa.2022.107248