Wheat TaAP2/ERF Genes Regulate Heat Tolerance Through Ethylene Signaling at Grain-Filling Stage
Wheat is a globally important crop, and its production is critically challenged by heat stress. To understand the heat tolerance mechanism at grain-filling stage in wheat, two genotypes, W156 (tolerant) and Brazil 32 (susceptible) were evaluated for their morphological responses and expressions of T...
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Veröffentlicht in: | Journal of plant growth regulation 2024-08, Vol.43 (8), p.2855-2872 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Wheat is a globally important crop, and its production is critically challenged by heat stress. To understand the heat tolerance mechanism at grain-filling stage in wheat, two genotypes, W156 (tolerant) and Brazil 32 (susceptible) were evaluated for their morphological responses and expressions of TaAP2/ERF super-family transcription factor genes under heat stress (at 37/27 °C) at 11 days and 13 days post-anthesis. The W156 showed significantly higher thousand kernel weight (TKW), chlorophyll fluorescence (Fv/Fm) and delayed senescence of flag leaf and exposed peduncle. Twenty-two differentially expressed genes (DEGs) were selected from in silico expression analysis of 630 TaAP2/ERF genes under abiotic stress and their RT-qPCR expression validation identified twenty major DEGs responsive to heat stress. Co-expression network analysis of these DEGs identified hub TF genes including
TraesCS1A02G221900
,
TraesCS6D02G324200
,
TraesCS6B02G331000
,
TraesCS4D02G298600
,
TraesCS5B02G193200,
and
TraesCS1A02G058400
. Gene Ontology analysis and Gene Set Enrichment Analysis further revealed that 16 (80%) out of the 20 DEGs were involved in the ethylene-activated signaling pathway. Those DEGs involved in ethylene signaling pathway were further validated in an additional pair of contrasting genotypes (Perenjori and Yitpi). Therefore, heat tolerance regulated by TaAP2/ERF genes at grain filling stage of wheat may be mainly through ethylene signaling pathway while maintaining seed development under heat stress. |
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ISSN: | 0721-7595 1435-8107 |
DOI: | 10.1007/s00344-024-11313-y |