Enhanced bacterial and virus disinfection with copper nanoparticle optimized LIG composite electrodes and filters

•Single-step fabrication of copper-LIG composite electrodes and filters.•Disinfection performance with bacteria and enteric virus.•The best electrochemical activity of Cu-LIG with 1% of Cu NPs.•Optimizing Cu-LIG disinfection performance with or without potential.•Application Cu-LIG membrane filters for water purification. Waterborne pathogens pose a lifelong threat, necessitating advanced disinfection systems with state-of-the-art materials. Laser-Induced Graphene (LIG), a 3-dimensional form of graphene, is a widely known electrode material for its electrically-induced antimicrobial properties. However, LIG surfaces exhibit antimicrobial properties exclusively in the presence of electricity. In this work, copper-doped LIG (Cu-LIG) composite electrodes and filters were developed with enhanced antimicrobial properties in single-step laser scribing. The work emphasizes the optimization of copper doping with LIG for both electrical and non-electrical-based disinfection. The copper doping was optimized to a minimal concentration (∼1%) just to enhance the electrochemical properties of LIG. Furthermore, the excess addition of copper was helpful towards non-electricity-based treatment without significant leaching. The prepared surfaces were tested in both electrodes and filter configuration and showed excellent antibacterial and antiviral activity against mixed bacterial culture and a model enteric virus, MS2 bacteriophage. On the application of 2.5 V with Cu-LIG electrodes, 6-log removal of bacteria and virus was achieved. Furthermore, the membrane-based electroconductive filters were tested in a flow-through configuration and demonstrated 6-log removal at 2.5 V with a flux of ∼ 500 (L·m2)/h with both bacteria and viruses at minimum energy expense. Additionally, reactive oxygen species scavenging and hydrogen peroxide generation experiments have confirmed the role of electrical effects and indirect oxidation on the inactivation mechanism. The prepared Cu-LIG composite surfaces showed potential for environmental remediation applications. [Display omitted]