In situ observation of cracks in gold nano-interconnects on flexible substrates

In situ observation of cracks in gold nano-interconnects on flexible substrates

Metallic conductors on polymeric substrates are frequently used for printed circuit boards or flexible displays. Optimization of these devices is mostly associated with the miniaturization of the conductors which changes their electrical and mechanical properties. We focus on crack formation in gold...

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Veröffentlicht in:Scripta materialia 2008-02, Vol.58 (3), p.175-178
Hauptverfasser: Olliges, Sven, Gruber, Patric A., Orso, Steffen, Auzelyte, Vaida, Ekinci, Yasin, Solak, Harun H., Spolenak, Ralph
Format: Artikel
Sprache:eng
Schlagworte:
Boards
Conductors
Cracking behavior
Fracture mechanics
Gold
Multilayer thin films
Nanocomposites
Nanocrystalline materials
Nanomaterials
Nanostructure
Printed circuits
Scanning electron microscopy (SEM)
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Beschreibung
Zusammenfassung:Metallic conductors on polymeric substrates are frequently used for printed circuit boards or flexible displays. Optimization of these devices is mostly associated with the miniaturization of the conductors which changes their electrical and mechanical properties. We focus on crack formation in gold nano-interconnects about 20 nm high, 40 nm wide and 1 mm long on flexible substrates. The fracture toughness of the gold nanolines is decreased significantly compared to bulk gold.
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2007.09.037