Morphological and microstructural evolution of phosphorous-rich layer in SnAgCu/Ni-P UBM solder joint
Interfacial morphologies and microstructure of Sn-3Ag-0.5Cu/Ni-P under bump metallization (UBM) with various phosphorous contents were investigated by transmission electron microscope (TEM) and field emission electron probe microanalyzer (FE-EPMA). It was revealed that as the Ni-Sn-P compound was fo...
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| Veröffentlicht in: | Journal of electronic materials 2007-11, Vol.36 (11), p.1469-1475 |
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| creator | LIN, Yung-Chi SHIH, Toung-Yi TIEN, Shih-Kang DUH, Jenq-Gong |
| description | Interfacial morphologies and microstructure of Sn-3Ag-0.5Cu/Ni-P under bump metallization (UBM) with various phosphorous contents were investigated by transmission electron microscope (TEM) and field emission electron probe microanalyzer (FE-EPMA). It was revealed that as the Ni-Sn-P compound was formed between the solder matrix and Ni-P UBM, the conventionally so-called phosphorous-rich (P-rich) layer was transformed to a series of layer compounds, including Ni^sub 3^P, Ni^sub 12^P^sub 5^ and Ni^sub 2^P. The relationship between Ni-Sn-P formation and evolution of P-rich layers was probed by electron microscopic characterization with the aid of the phase diagram of Ni-P. On the basis of the TEM micrograph, the selected area diffraction (SAD) pattern, and the FE-EPMA results, the detailed phase evolution of P-rich layers in the SnAgCu/Ni-P joint was revealed and proposed. [PUBLICATION ABSTRACT] |
| doi_str_mv | 10.1007/s11664-007-0253-y |
| format | Article |
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It was revealed that as the Ni-Sn-P compound was formed between the solder matrix and Ni-P UBM, the conventionally so-called phosphorous-rich (P-rich) layer was transformed to a series of layer compounds, including Ni^sub 3^P, Ni^sub 12^P^sub 5^ and Ni^sub 2^P. The relationship between Ni-Sn-P formation and evolution of P-rich layers was probed by electron microscopic characterization with the aid of the phase diagram of Ni-P. On the basis of the TEM micrograph, the selected area diffraction (SAD) pattern, and the FE-EPMA results, the detailed phase evolution of P-rich layers in the SnAgCu/Ni-P joint was revealed and proposed. [PUBLICATION ABSTRACT]</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-007-0253-y</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>New York, NY: Institute of Electrical and Electronics Engineers</publisher><subject>Analysis ; Applied sciences ; Brazing. Soldering ; Condensed matter: structure, mechanical and thermal properties ; Cross-disciplinary physics: materials science; rheology ; Electron microscopes ; Exact sciences and technology ; Intermetallic compounds ; Joining, thermal cutting: metallurgical aspects ; Lead free solders ; Materials science ; Metals. Metallurgy ; Nickel ; Phase diagrams and microstructures developed by solidification and solid-solid phase transformations ; Phase diagrams of metals and alloys ; Phase transitions ; Phosphorus ; Physics ; Structure and morphology; thickness ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thin film structure and morphology ; Tin</subject><ispartof>Journal of electronic materials, 2007-11, Vol.36 (11), p.1469-1475</ispartof><rights>2008 INIST-CNRS</rights><rights>Copyright Minerals, Metals & Materials Society Nov 2007</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c399t-eec720c4f9bbedbd07a552df72946200fa47406d26daa85569a07da297504d983</citedby><cites>FETCH-LOGICAL-c399t-eec720c4f9bbedbd07a552df72946200fa47406d26daa85569a07da297504d983</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>309,310,314,776,780,785,786,23909,23910,25118,27901,27902</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=19690849$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>LIN, Yung-Chi</creatorcontrib><creatorcontrib>SHIH, Toung-Yi</creatorcontrib><creatorcontrib>TIEN, Shih-Kang</creatorcontrib><creatorcontrib>DUH, Jenq-Gong</creatorcontrib><title>Morphological and microstructural evolution of phosphorous-rich layer in SnAgCu/Ni-P UBM solder joint</title><title>Journal of electronic materials</title><description>Interfacial morphologies and microstructure of Sn-3Ag-0.5Cu/Ni-P under bump metallization (UBM) with various phosphorous contents were investigated by transmission electron microscope (TEM) and field emission electron probe microanalyzer (FE-EPMA). It was revealed that as the Ni-Sn-P compound was formed between the solder matrix and Ni-P UBM, the conventionally so-called phosphorous-rich (P-rich) layer was transformed to a series of layer compounds, including Ni^sub 3^P, Ni^sub 12^P^sub 5^ and Ni^sub 2^P. The relationship between Ni-Sn-P formation and evolution of P-rich layers was probed by electron microscopic characterization with the aid of the phase diagram of Ni-P. On the basis of the TEM micrograph, the selected area diffraction (SAD) pattern, and the FE-EPMA results, the detailed phase evolution of P-rich layers in the SnAgCu/Ni-P joint was revealed and proposed. [PUBLICATION ABSTRACT]</description><subject>Analysis</subject><subject>Applied sciences</subject><subject>Brazing. 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Soldering</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Electron microscopes</topic><topic>Exact sciences and technology</topic><topic>Intermetallic compounds</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Lead free solders</topic><topic>Materials science</topic><topic>Metals. Metallurgy</topic><topic>Nickel</topic><topic>Phase diagrams and microstructures developed by solidification and solid-solid phase transformations</topic><topic>Phase diagrams of metals and alloys</topic><topic>Phase transitions</topic><topic>Phosphorus</topic><topic>Physics</topic><topic>Structure and morphology; thickness</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thin film structure and morphology</topic><topic>Tin</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>LIN, Yung-Chi</creatorcontrib><creatorcontrib>SHIH, Toung-Yi</creatorcontrib><creatorcontrib>TIEN, Shih-Kang</creatorcontrib><creatorcontrib>DUH, Jenq-Gong</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><collection>Ceramic Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>LIN, Yung-Chi</au><au>SHIH, Toung-Yi</au><au>TIEN, Shih-Kang</au><au>DUH, Jenq-Gong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Morphological and microstructural evolution of phosphorous-rich layer in SnAgCu/Ni-P UBM solder joint</atitle><jtitle>Journal of electronic materials</jtitle><date>2007-11-01</date><risdate>2007</risdate><volume>36</volume><issue>11</issue><spage>1469</spage><epage>1475</epage><pages>1469-1475</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>Interfacial morphologies and microstructure of Sn-3Ag-0.5Cu/Ni-P under bump metallization (UBM) with various phosphorous contents were investigated by transmission electron microscope (TEM) and field emission electron probe microanalyzer (FE-EPMA). It was revealed that as the Ni-Sn-P compound was formed between the solder matrix and Ni-P UBM, the conventionally so-called phosphorous-rich (P-rich) layer was transformed to a series of layer compounds, including Ni^sub 3^P, Ni^sub 12^P^sub 5^ and Ni^sub 2^P. The relationship between Ni-Sn-P formation and evolution of P-rich layers was probed by electron microscopic characterization with the aid of the phase diagram of Ni-P. On the basis of the TEM micrograph, the selected area diffraction (SAD) pattern, and the FE-EPMA results, the detailed phase evolution of P-rich layers in the SnAgCu/Ni-P joint was revealed and proposed. [PUBLICATION ABSTRACT]</abstract><cop>New York, NY</cop><pub>Institute of Electrical and Electronics Engineers</pub><doi>10.1007/s11664-007-0253-y</doi><tpages>7</tpages></addata></record> |
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| subjects | Analysis Applied sciences Brazing. Soldering Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Electron microscopes Exact sciences and technology Intermetallic compounds Joining, thermal cutting: metallurgical aspects Lead free solders Materials science Metals. Metallurgy Nickel Phase diagrams and microstructures developed by solidification and solid-solid phase transformations Phase diagrams of metals and alloys Phase transitions Phosphorus Physics Structure and morphology thickness Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology Tin |
| title | Morphological and microstructural evolution of phosphorous-rich layer in SnAgCu/Ni-P UBM solder joint |
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