Low temperature RTP for BCB curing

Rapid thermal processing (RTP) applications are rapidly expanding from the original processes, typically performed above 1000 °C (e.g., post-implant annealing and silicon oxidation) to lower temperature applications such as cobalt and nickel silicide formation with process steps performed as low as...

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Veröffentlicht in:Microelectronic engineering 2007-11, Vol.84 (11), p.2646-2652
Hauptverfasser: Ouaknine, Michel, Malik, Igor J., Odera, Masato, Ishigaki, Toshikazu, Ueda, Takeshi, Fukada, Takashi, Yoo, Woo Sik, Soussan, Philippe, Muller, Philippe
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Sprache:eng
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