Unlocking Spatial Surface Energy in Porous Skeletons: a Pathway to Bridging Electronic Circuits from 2D to 3D Architectures

Conventional approaches to creating high‐resolution electric circuits face challenges such as the requirement for skilled personnel and expensive equipment. In response, we propose an innovative strategy that leverages a photochemically modified porous polymer skeleton for in‐situ circuit fabricatio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Angewandte Chemie International Edition 2024-11, Vol.63 (45), p.e202412146-n/a
Hauptverfasser: Feng, Shengwei, Zhao, Yuanyi, Xie, Xinjian, Sun, Yingxue, Luo, Xiongwei, Feng, Wenqian
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Conventional approaches to creating high‐resolution electric circuits face challenges such as the requirement for skilled personnel and expensive equipment. In response, we propose an innovative strategy that leverages a photochemically modified porous polymer skeleton for in‐situ circuit fabrication. By developing maskless surface energy manipulation that guides PEDOT:PSS‐based conductive ink deposition, electric circuits with high precision, density, stability and adaptability are effortlessly engineered within or atop the porous skeleton, enabling transitions between 2D and 3D circuit configurations. This process simplifies prototyping while significantly reducing costs and maintaining efficiency, promising advancements across various technological sectors. By employing maskless surface energy manipulation on a porous skeleton to guide PEDOT conductive ink deposition, electric circuits with high precision, density, stability, and adaptability are effortlessly engineered within or atop the porous skeleton. This facilitates transitions between 2D and 3D circuit configurations in electronic devices, whether rigid or flexible.
ISSN:1433-7851
1521-3773
1521-3773
DOI:10.1002/anie.202412146