Interaction of ultrasonic guided waves with interfacial debonding in a stiffened composite plate under variable temperature and operational conditions

•Guided wave interaction study in interfacial debonded stiffened panel under loading.•Developed multiphysics and multistudy FE numerical model using COMSOL Multiphysics®.•Waveforms are compared for peak amplitude, energy, NCM and variance of CWT peak.•Mode conversion (A0-S0) occurs in bonded stiffen...

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Veröffentlicht in:Ultrasonics 2024-08, Vol.142, p.107378, Article 107378
Hauptverfasser: Prakash Kalgutkar, Akshay, Banerjee, Sauvik
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Sprache:eng
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Zusammenfassung:•Guided wave interaction study in interfacial debonded stiffened panel under loading.•Developed multiphysics and multistudy FE numerical model using COMSOL Multiphysics®.•Waveforms are compared for peak amplitude, energy, NCM and variance of CWT peak.•Mode conversion (A0-S0) occurs in bonded stiffened panels and aids in debond detection.•NCM value increases with debonding length and it reduces with temperature intensities. Stiffeners play a vital role in strengthening thin panels in a wide range of engineering constructions by reducing additional structural weight. However, these structures are vulnerable to issues such as interlayer delamination or skin-stiffener interfacial debonding due to high stress levels developed from external environmental conditions and operational loadings. In contrast, ultrasonic-guided wave (UGW) techniques exhibit an efficient and precise approach for monitoring discontinuities or damages in composite structures. There is a lack of research on understanding the characteristics of the interaction between UGW and interfacial debonding when in-plane edge loading and environmental factors are simultaneously taken into account. Therefore, this study is motivated by the need to develop a multiphysics numerical model which employs a commercially available finite element software, COMSOL Multiphysics®, to simulate UGW propagation in a stiffened composite plate with debonding at the plate-stiffener interface through a piezoelectric transducer under the combined influence of in-plane edge load and hygrothermal environment. The stiffened plate and piezoelectric patches are modelled with the tetrahedral element, and the bottom surface of the attached stiffener has a through-width 0.1 mm deep groove simulated for debonding. The developed FE model is validated against the results of the conducted experiments and those found in the available literature through the correlation coefficient. Further, the study conducts a comprehensive parametric investigation on stiffened cross-ply (0/90/0) laminated plates, considering variations in debonding size, in-plane load, and hygrothermal load intensity through the excitation of A0 mode. The acquired response is processed to compare the peak amplitude of various modes and energy of the waveform. Additionally, statistical indices such as normalised correlation moment (NCM) and variance of the continuous wavelet transform (CWT) peak are estimated to understand the impact of various parameters on wavefor
ISSN:0041-624X
1874-9968
1874-9968
DOI:10.1016/j.ultras.2024.107378