3D Printing of Composite Radiation Shielding for Broad Spectrum Protection of Electronic Systems

The miniaturization of satellite systems has compounded the need to protect microelectronic components from damaging radiation. Current approaches to mitigate this damage, such as indiscriminate mass shielding, built‐in redundancies, and radiation‐hardened electronics, introduce high size, weight, power, and cost penalties that impact the overall performance of the satellite or launch opportunities. Additive manufacturing provides an appealing strategy to deposit radiation shielding only on susceptible components within an electronic assembly. Here, a versatile material platform and process to conformally print customized composite inks at room temperature directly and selectively onto commercial‐off‐the‐shelf electronics is described. The suite of inks uses a flexible styrene‐isoprene‐styrene block copolymer binder that can be filled with particles of different atomic densities for diverging radiation shielding capabilities. Additionally, the system enables the combination of multiple distinct particle species within the same printed structure. The method can produce graded shielding that offers improved radiation attenuation by tailoring both shield geometry and composition to provide comprehensive protection from a broad range of radiation species. The authors anticipate this alternative to traditional shielding methods will enable the rapid proliferation of the next generation of compact satellite designs. Current radiation mitigation techniques to protect electronics in space introduce a high size, weight, power and cost penalty to system design. An alternative additive manufacturing‐based method using composite inks to spot shield only vulnerable electronics minimizing the overall impact shielding causes to the system is described. The approach offers control over both the composition and geometry of shielding materials.