High‐Throughput Growth of Armored Perovskite Single Crystal Fibers for Pixelated Arrays
The poor machinability of halide perovskite crystals severely hampered their practical applications. Here a high‐throughput growth method is reported for armored perovskite single‐crystal fibers (SCFs). The mold‐embedded melt growth (MEG) method provides each SCF with a capillary quartz shell, thus...
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Veröffentlicht in: | Small (Weinheim an der Bergstrasse, Germany) Germany), 2024-09, Vol.20 (38), p.e2401624-n/a |
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Sprache: | eng |
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Zusammenfassung: | The poor machinability of halide perovskite crystals severely hampered their practical applications. Here a high‐throughput growth method is reported for armored perovskite single‐crystal fibers (SCFs). The mold‐embedded melt growth (MEG) method provides each SCF with a capillary quartz shell, thus guaranteeing their integrality when cutting and polishing. Hundreds of perovskite SCFs, exemplified by CsPbBr3, CsPbCl3, and CsPbBr2.5I0.5, with customized dimensions (inner diameters of 150–1000 µm and length of several centimeters), are grown in one batch, with all the SCFs bearing homogeneity in shape, orientation, and optical/electronic properties. Versatile assembly protocols are proposed to directly integrate the SCFs into arrays. The assembled array detectors demonstrated low‐level dark currents (< 1 nA) with negligible drift, low detection limit (< 44.84 nGy s−1), and high sensitivity (61147 µC Gy−1 cm−2). Moreover, the SCFs as isolated pixels are free of signal crosstalk while showing uniform X‐ray photocurrents, which is in favor of high spatial resolution X‐ray imaging. As both MEG and the assembly of SCFs involve none sophisticated processes limiting the scalable fabrication, the strategy is considered to meet the preconditions of high‐throughput productions.
The mold‐embedded melt growth (MEG) method to realize high‐throughput production of perovskite single‐crystal fibers. The single‐crystal fibers possess homogeneity in shape, crystalline orientation, and optical/electronic properties, based on which versatile assembly protocols are developed to directly integrate them into arrays as pixels. |
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ISSN: | 1613-6810 1613-6829 1613-6829 |
DOI: | 10.1002/smll.202401624 |