Rapid In‐Plane Pattern Growth for Large‐Area Inverse Replication Through Electrohydrodynamic Instability of Polymer Films

Nanopatterning driven by electrohydrodynamic (EHD) instability can aid in the resolution of the drawbacks inherent in conventional imprinting or other molding methods. This is because EHD force negates the requirement of physical contact and is easily tuned. However, its potential has not examined o...

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Veröffentlicht in:Small (Weinheim an der Bergstrasse, Germany) Germany), 2024-08, Vol.20 (34), p.e2400155-n/a
Hauptverfasser: Park, Hyunje, Hwang, Jaeseok, Chae, Heejoon, Kang, Dae Joon
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Sprache:eng
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Zusammenfassung:Nanopatterning driven by electrohydrodynamic (EHD) instability can aid in the resolution of the drawbacks inherent in conventional imprinting or other molding methods. This is because EHD force negates the requirement of physical contact and is easily tuned. However, its potential has not examined owing to the limited size of the pattern replica (several to tens of micrometers). Thus, this study proposes a new route for large‐area patterning through high‐speed evolution of EHD‐driven pattern growth along the in‐plane axis. Through the acceleration of the in‐plane growth, while selectively controlling a specific edge growth, the pattern replica area can be extended from the micro‐ to centimeter scale with high fidelity. Moreover, even in the case of nonuniform contact mode, the proposed rapid in‐plane growth mode facilitates uniform large‐scale replication, which is not possible in conventional imprinting or other molding methods. In‐plane growth mechanism of an electrohydrodynamic‐driven structure is proposed to achieve uniform large‐scale nanopattern replication in extended replication mode. Through the rapid in‐plane growth with the controlled edge growth mode, the pattern replica area can be extended from the micro‐ to centimeter scale with high fidelity. The proposed route enables uniform large‐scale patterning even in nonuniform contact mode.
ISSN:1613-6810
1613-6829
1613-6829
DOI:10.1002/smll.202400155