Polymer-based semiconductor wafer cleaning: The roles of organic acid, processing solvent, and polymer hydrophobicity

[Display omitted] •Polymer-based wafer cleaning via flake formation and peeling off phenomenon.•Theoretical simulations according to thermodynamics-based particle removal mechanism.•Analyses of cleaning efficiency according to organic acid, solvent, and substrate.•Effective nanoparticle removal on b...

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Veröffentlicht in:	Chemical engineering journal (Lausanne, Switzerland : 1996) Switzerland : 1996), 2023-08, Vol.470, p.144102, Article 144102
Hauptverfasser:	Yu, Seong Hoon, Jeon, Hayoung, Ko, Hyunki, Cha, Ji Hoon, Jeon, Soyeon, Jae, Mingyu, Nam, Geon-Hee, Kim, Kyoungsuk, Gil, Yeongjin, Lee, Kuntack, Chung, Dae Sung
Format:	Artikel
Sprache:	eng
Schlagworte:	energy Flakes hydrophobicity Nanoparticles Organic acids Polymers Processing solvent semiconductors solvents thermodynamic models thermoplastics Wafer cleaning
Online-Zugang:	Volltext
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Beschreibung
Zusammenfassung:	[Display omitted] •Polymer-based wafer cleaning via flake formation and peeling off phenomenon.•Theoretical simulations according to thermodynamics-based particle removal mechanism.•Analyses of cleaning efficiency according to organic acid, solvent, and substrate.•Effective nanoparticle removal on both low-k and high-k wafers. We propose a novel polymer-based cleaning technique to remove nanoparticles (
ISSN:	1385-8947
DOI:	10.1016/j.cej.2023.144102