Synthesis and properties of hydrogen-bonded poly(amide-imide) hybrid films

Poly(amide‐imide), PI, hybrid films are prepared by using sol–gel techniques. First, the poly(amide amic acid) with controlled block chain length of 5000 and 10,000 g/mol and uncontrolled chain length are synthesized by condensation reaction with 4,4′‐diaminodiphenyl ether (ODA), 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), trimellitic anhydride chloride (TMAC) and terminated with p‐aminopropyltrimethoxysilane (APrTMOS). And then the imidization reactions of poly (amide amic acid) are proceeded to obtain the poly (amide‐imide) hybrid film. Hybrid films with 5000 g/mol block chain length possess higher storage modulus, lower glass transition temperature and damping intensity comparing to films with 10,000 g/mol block chain length. The addition of TMAC to the poly(amide‐imide) hybrids is due to the increase of toughness and intermolecular hydrogen bonding, which is the average strength of intermolecular bonding and studied by the hydrogen‐bonded fraction (fbonded), frequency difference (Δν) and shiftment. Meanwhile, PI hybrid films containing more APrTMOS and TMAC content possess higher thermal and mechanical properties. On the other hand, hybrid films with 10,000 g/mol block chain length and more TMAC content have higher gas permeabilities than other films. The degradation temperatures of 5 wt % loss of all hybrid films are all higher than 540°C and increased as the increase of TMAC content. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007