Physical Modelling of Microstructure Development during Technological Processes with Intensive Incremental Deformation

Convenient structure adjustment and thereby the achievement of suitable material and technological properties is one of the very important areas of technological as well as material research. In general, this issue includes a great number of parameters and variables. To find suitable technological c...

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Veröffentlicht in:Key engineering materials 2007-08, Vol.345-346, p.943-946
Hauptverfasser: Malina, Jiří, Meyer, Lothar W., Mašek, Bohuslav, Staňková, H., Skálová, Ludmila
Format: Artikel
Sprache:eng
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Zusammenfassung:Convenient structure adjustment and thereby the achievement of suitable material and technological properties is one of the very important areas of technological as well as material research. In general, this issue includes a great number of parameters and variables. To find suitable technological conditions, it is possible to use various kinds of modeling processes. One of them is the utilization of thermomechanical simulators, which allow simulating the conditions of the real processes to be simulated with sufficient accuracy. It is then possible to perform the optimization on smaller specimens, while monitoring the real conditions with higher accuracy. This method was used for the optimization of unconventional technological processes for selected alloying strategies of low-alloyed multiphase steels. These strategies are designed to be applied to technologies, which combine anisothermal forming and thermomechanical treatment of quasimassive components using intensive plastic deformation. Incremental deformations allow a high amount of deformation to be reached. It is also possible to obtain very fine grained structures by a suitable choice of temperature. By a suitable choice of temperature it is also possible to obtain structures with very fine grain. At the same time, the morphology of the structure and thus also its final mechanical properties can be significantly influenced this way.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.345-346.943