Evidence for the intergranular segregation of tin to grain boundaries of a Cu–Sn alloy and its consequences for dynamic embrittlement

Observations by STEM and EELS have provided evidence of intergranular segregation of tin in a slowly cooled Cu–8%Sn alloy. Aging of this alloy at 250 °C was found to increase the susceptibility to dynamic embrittlement, which would be consistent with increased tin segregation at this temperature.

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Bibliographische Detailangaben
Veröffentlicht in:	Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2007-06, Vol.458 (1), p.123-125
Hauptverfasser:	Liu, XinYu, Tham, Douglas, Yates, Douglas, McMahon, Charles J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cu–Sn alloy Dynamic embrittlement Exact sciences and technology Fractures Intergranular segregation Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy
Online-Zugang:	Volltext
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Beschreibung
Zusammenfassung:	Observations by STEM and EELS have provided evidence of intergranular segregation of tin in a slowly cooled Cu–8%Sn alloy. Aging of this alloy at 250 °C was found to increase the susceptibility to dynamic embrittlement, which would be consistent with increased tin segregation at this temperature.
ISSN:	0921-5093 1873-4936
DOI:	10.1016/j.msea.2006.12.103