The Direct Bonding of Metals to Ceramics for the Manufactured Microwave Packages
The present paper refers to the manufacturing of some planar metal-ceramic packages for which metal-ceramic soldering is realised by the metal to metal diffusion mechanism. To fabricate a plane metal-ceramic package, we used ceramic substrates (content of Al sub(2)O sub(3)-99.6%, excellent planarity...
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| Veröffentlicht in: | Key engineering materials 2001, Vol.206-213 (I), p.515-518 |
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| container_end_page | 518 |
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| container_issue | I |
| container_start_page | 515 |
| container_title | Key engineering materials |
| container_volume | 206-213 |
| creator | Anton, Ioana Muntean, Marcela Danila, M. Anton, Cornel Gavrıla, Raluca Birsan, C. |
| description | The present paper refers to the manufacturing of some planar metal-ceramic packages for which metal-ceramic soldering is realised by the metal to metal diffusion mechanism. To fabricate a plane metal-ceramic package, we used ceramic substrates (content of Al sub(2)O sub(3)-99.6%, excellent planarity, and surface roughness under 0.15 microns); gold plated copper (of high conductivity without oxygen) terminals and technological processes specific to the electronic component industry. |
| doi_str_mv | 10.4028/www.scientific.net/KEM.206-213.515 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_29907322</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>29712504</sourcerecordid><originalsourceid>FETCH-LOGICAL-c366t-244d6c2bb597673a2b18d85311efeacc69c537de417ecb1b902a335bf1665ca93</originalsourceid><addsrcrecordid>eNqVkbtOwzAUQCMEEqXwD54YkJL6ETv2COUpWtGhzJbj3BRDm4DtUPH3GBWJEZiuh-Mj3Xuy7IzgosRUTrbbbRGsgy661tmigzi5v5oXFIucElZwwveyERGC5qpSfD-9MWG5klQcZkchPGPMiCR8lC2WT4AunQcb0UXfNa5bob5Fc4hmHVDs0RS82TgbUNt7FBM8N93QGhsHDw2aO-v7rXkHtDD2xawgHGcHbfoKJ99znD1eXy2nt_ns4eZuej7LLRMi5rQsG2FpXXNViYoZWhPZSM4IgRaMtUJZzqoGSlKBrUmtMDWM8bpNS3FrFBtnpzvvq-_fBghRb1ywsF6bDvohaKoUrhilfwArQjkufwdJKaWsZAIvdmDaPQQPrX71bmP8hyZYf-XRKY_-yaNTHp3y6JQnWZhOeZLkcieJ3nQhgn3Sz_3gu3Sz_2g-AbV2oow</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>21488878</pqid></control><display><type>article</type><title>The Direct Bonding of Metals to Ceramics for the Manufactured Microwave Packages</title><source>Scientific.net Journals</source><creator>Anton, Ioana ; Muntean, Marcela ; Danila, M. ; Anton, Cornel ; Gavrıla, Raluca ; Birsan, C.</creator><creatorcontrib>Anton, Ioana ; Muntean, Marcela ; Danila, M. ; Anton, Cornel ; Gavrıla, Raluca ; Birsan, C.</creatorcontrib><description>The present paper refers to the manufacturing of some planar metal-ceramic packages for which metal-ceramic soldering is realised by the metal to metal diffusion mechanism. To fabricate a plane metal-ceramic package, we used ceramic substrates (content of Al sub(2)O sub(3)-99.6%, excellent planarity, and surface roughness under 0.15 microns); gold plated copper (of high conductivity without oxygen) terminals and technological processes specific to the electronic component industry.</description><identifier>ISSN: 1013-9826</identifier><identifier>ISSN: 1662-9795</identifier><identifier>EISSN: 1662-9795</identifier><identifier>DOI: 10.4028/www.scientific.net/KEM.206-213.515</identifier><language>eng</language><publisher>Trans Tech Publications Ltd</publisher><subject>Diffusion ; Microwave devices ; Soldering ; Substrates ; Surface phenomena</subject><ispartof>Key engineering materials, 2001, Vol.206-213 (I), p.515-518</ispartof><rights>2002 Trans Tech Publications Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttps://www.scientific.net/Image/TitleCover/432?width=600</thumbnail><link.rule.ids>309,310,314,780,784,789,790,4024,4050,4051,23930,23931,25140,27923,27924,27925</link.rule.ids></links><search><creatorcontrib>Anton, Ioana</creatorcontrib><creatorcontrib>Muntean, Marcela</creatorcontrib><creatorcontrib>Danila, M.</creatorcontrib><creatorcontrib>Anton, Cornel</creatorcontrib><creatorcontrib>Gavrıla, Raluca</creatorcontrib><creatorcontrib>Birsan, C.</creatorcontrib><title>The Direct Bonding of Metals to Ceramics for the Manufactured Microwave Packages</title><title>Key engineering materials</title><description>The present paper refers to the manufacturing of some planar metal-ceramic packages for which metal-ceramic soldering is realised by the metal to metal diffusion mechanism. To fabricate a plane metal-ceramic package, we used ceramic substrates (content of Al sub(2)O sub(3)-99.6%, excellent planarity, and surface roughness under 0.15 microns); gold plated copper (of high conductivity without oxygen) terminals and technological processes specific to the electronic component industry.</description><subject>Diffusion</subject><subject>Microwave devices</subject><subject>Soldering</subject><subject>Substrates</subject><subject>Surface phenomena</subject><issn>1013-9826</issn><issn>1662-9795</issn><issn>1662-9795</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><recordid>eNqVkbtOwzAUQCMEEqXwD54YkJL6ETv2COUpWtGhzJbj3BRDm4DtUPH3GBWJEZiuh-Mj3Xuy7IzgosRUTrbbbRGsgy661tmigzi5v5oXFIucElZwwveyERGC5qpSfD-9MWG5klQcZkchPGPMiCR8lC2WT4AunQcb0UXfNa5bob5Fc4hmHVDs0RS82TgbUNt7FBM8N93QGhsHDw2aO-v7rXkHtDD2xawgHGcHbfoKJ99znD1eXy2nt_ns4eZuej7LLRMi5rQsG2FpXXNViYoZWhPZSM4IgRaMtUJZzqoGSlKBrUmtMDWM8bpNS3FrFBtnpzvvq-_fBghRb1ywsF6bDvohaKoUrhilfwArQjkufwdJKaWsZAIvdmDaPQQPrX71bmP8hyZYf-XRKY_-yaNTHp3y6JQnWZhOeZLkcieJ3nQhgn3Sz_3gu3Sz_2g-AbV2oow</recordid><startdate>2001</startdate><enddate>2001</enddate><creator>Anton, Ioana</creator><creator>Muntean, Marcela</creator><creator>Danila, M.</creator><creator>Anton, Cornel</creator><creator>Gavrıla, Raluca</creator><creator>Birsan, C.</creator><general>Trans Tech Publications Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope><scope>7QF</scope><scope>8BQ</scope><scope>JG9</scope></search><sort><creationdate>2001</creationdate><title>The Direct Bonding of Metals to Ceramics for the Manufactured Microwave Packages</title><author>Anton, Ioana ; Muntean, Marcela ; Danila, M. ; Anton, Cornel ; Gavrıla, Raluca ; Birsan, C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c366t-244d6c2bb597673a2b18d85311efeacc69c537de417ecb1b902a335bf1665ca93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Diffusion</topic><topic>Microwave devices</topic><topic>Soldering</topic><topic>Substrates</topic><topic>Surface phenomena</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Anton, Ioana</creatorcontrib><creatorcontrib>Muntean, Marcela</creatorcontrib><creatorcontrib>Danila, M.</creatorcontrib><creatorcontrib>Anton, Cornel</creatorcontrib><creatorcontrib>Gavrıla, Raluca</creatorcontrib><creatorcontrib>Birsan, C.</creatorcontrib><collection>CrossRef</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Aluminium Industry Abstracts</collection><collection>METADEX</collection><collection>Materials Research Database</collection><jtitle>Key engineering materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Anton, Ioana</au><au>Muntean, Marcela</au><au>Danila, M.</au><au>Anton, Cornel</au><au>Gavrıla, Raluca</au><au>Birsan, C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The Direct Bonding of Metals to Ceramics for the Manufactured Microwave Packages</atitle><jtitle>Key engineering materials</jtitle><date>2001</date><risdate>2001</risdate><volume>206-213</volume><issue>I</issue><spage>515</spage><epage>518</epage><pages>515-518</pages><issn>1013-9826</issn><issn>1662-9795</issn><eissn>1662-9795</eissn><abstract>The present paper refers to the manufacturing of some planar metal-ceramic packages for which metal-ceramic soldering is realised by the metal to metal diffusion mechanism. To fabricate a plane metal-ceramic package, we used ceramic substrates (content of Al sub(2)O sub(3)-99.6%, excellent planarity, and surface roughness under 0.15 microns); gold plated copper (of high conductivity without oxygen) terminals and technological processes specific to the electronic component industry.</abstract><pub>Trans Tech Publications Ltd</pub><doi>10.4028/www.scientific.net/KEM.206-213.515</doi><tpages>4</tpages></addata></record> |
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| identifier | ISSN: 1013-9826 |
| ispartof | Key engineering materials, 2001, Vol.206-213 (I), p.515-518 |
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| language | eng |
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| source | Scientific.net Journals |
| subjects | Diffusion Microwave devices Soldering Substrates Surface phenomena |
| title | The Direct Bonding of Metals to Ceramics for the Manufactured Microwave Packages |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T12%3A55%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20Direct%20Bonding%20of%20Metals%20to%20Ceramics%20for%20the%20Manufactured%20Microwave%20Packages&rft.jtitle=Key%20engineering%20materials&rft.au=Anton,%20Ioana&rft.date=2001&rft.volume=206-213&rft.issue=I&rft.spage=515&rft.epage=518&rft.pages=515-518&rft.issn=1013-9826&rft.eissn=1662-9795&rft_id=info:doi/10.4028/www.scientific.net/KEM.206-213.515&rft_dat=%3Cproquest_cross%3E29712504%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=21488878&rft_id=info:pmid/&rfr_iscdi=true |