The Direct Bonding of Metals to Ceramics for the Manufactured Microwave Packages

The Direct Bonding of Metals to Ceramics for the Manufactured Microwave Packages

The present paper refers to the manufacturing of some planar metal-ceramic packages for which metal-ceramic soldering is realised by the metal to metal diffusion mechanism. To fabricate a plane metal-ceramic package, we used ceramic substrates (content of Al sub(2)O sub(3)-99.6%, excellent planarity...

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Veröffentlicht in:Key engineering materials 2001, Vol.206-213 (I), p.515-518
Hauptverfasser: Anton, Ioana, Muntean, Marcela, Danila, M., Anton, Cornel, Gavrıla, Raluca, Birsan, C.
Format: Artikel
Sprache:eng
Schlagworte:
Diffusion
Microwave devices
Soldering
Substrates
Surface phenomena
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Beschreibung
Zusammenfassung:The present paper refers to the manufacturing of some planar metal-ceramic packages for which metal-ceramic soldering is realised by the metal to metal diffusion mechanism. To fabricate a plane metal-ceramic package, we used ceramic substrates (content of Al sub(2)O sub(3)-99.6%, excellent planarity, and surface roughness under 0.15 microns); gold plated copper (of high conductivity without oxygen) terminals and technological processes specific to the electronic component industry.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.206-213.515