Measurement of interfacial crack propagation energy-related problems and examples of results of buldge-and-blister test
The mechanical strength of interfaces between two different materials is a critical point, as well on a fundamental as on a practical aspect. Indeed, interfacial debonding is a frequent failure mechanism for multimaterial parts or coatings, which are more and more in use in advanced technologies. Se...
Gespeichert in:
Veröffentlicht in: | Mécanique & industries 2004-07, Vol.5 (4), p.441-450 |
---|---|
1. Verfasser: | |
Format: | Artikel |
Sprache: | fre |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The mechanical strength of interfaces between two different materials is a critical point, as well on a fundamental as on a practical aspect. Indeed, interfacial debonding is a frequent failure mechanism for multimaterial parts or coatings, which are more and more in use in advanced technologies. Several general considerations are introduced about interfacial debonding phenomena and interfacial fracture mechanics, aiming at criteria to define the most relevant adhesion mechanical tests, able to provide reproducible and physically significant results. Among the available experimental techniques for mechanical adhesion measurement, those which provide reliable values of interfacial crack propagation energy are emphasized. The example of bulge and blister testing is developed in more details. Results obtained by this technique on various film/strate systems are presented and commented on. |
---|---|
ISSN: | 1296-2139 |
DOI: | 10.1051/meca:2004044 |