A New Modelling of Dynamic Recrystallization - Application to Blanking Process of Thin Sheet in Copper Alloy

Blanking process is widely used by electronic and micromechanical industries to produce small and thin components in large quantities. To take into consideration the influence of strain rate and temperature on precision blanking of thin sheet in copper alloy, a thermo-elasto-visco-plastic modelling has been developed in [1]. Furthermore the blanking of thin sheet in Cual copper presents dynamic recrystallization. A new modelling of dynamic recrystallization based on the thermodynamics of irreversible processes is proposed. Blanking simulations of Cual copper sheet are performed to analyze the softening effect induced by dynamic recrystallization.