On the PEEK composites reinforced by surface-modified nano-silica

The nano-sized silica fillers reinforced poly(ether ether ketone) (PEEK) composites were fabricated by means of compression molding technique. The nano-sized silica, measuring 30 nm in size, was firstly modified by surface pretreatment with stearic acid. The performances and properties of the result...

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Veröffentlicht in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2007-06, Vol.458 (1), p.158-169
Hauptverfasser: Lai, Y.H., Kuo, M.C., Huang, J.C., Chen, M.
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Sprache:eng
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Zusammenfassung:The nano-sized silica fillers reinforced poly(ether ether ketone) (PEEK) composites were fabricated by means of compression molding technique. The nano-sized silica, measuring 30 nm in size, was firstly modified by surface pretreatment with stearic acid. The performances and properties of the resulting PEEK/SiO 2 nanocomposites were examined in terms of tensile loading, hardness, dynamic mechanical analysis (DMA), thermomechanical analysis (TMA), thermogravimetry analysis (TGA), differential scanning calorimetry (DSC), X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The modified nano-silica was seen to disperse more uniformly than the unmodified counterpart. The XRD patterns of the modified silica reinforced PEEK composites reveal a systematic shift toward higher angles, suggesting the smaller d-spacing of the PEEK crystallites. The coefficient of thermal expansion (CTE) becomes lowered when the content of the nano-silica increases. Furthermore, the CTE of the modified silica filled PEEK nanocomposites shows the higher CTE values. A logic model is proposed. The increment of the dynamic modulus for the PEEK nanocomposites is up to 40% at elevated temperatures from 100 to 250 °C, indicating the apparent improvement of elevated temperature mechanical properties.
ISSN:0921-5093
1873-4936
DOI:10.1016/j.msea.2007.01.085