Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint

A single shear lap solder joint specimen with lead-free eutectic Sn–Ag solder on copper substrates was exposed to 1500 thermomechanical fatigue (TMF) cycles between −15° (3.5 h) and 150 °C (20 min) to generate intrinsic thermal strains. The 0.15-mm-thick solder joint had a cross-sectional area of 1 mm 2. Orientation imaging microscopy was used to examine changes in the tin microstructure as a function of the number of TMF cycles. The tin phase consisted of embedded minority orientations within an initial dominant orientation, which varied by about 25° from one end of the joint to the other, by means of lattice curvature and low angle boundaries. Between about 150 and 750 cycles, an incremental recrystallization/grain growth process occurred where a minority solidification twin orientation grew and consumed the dominant initial orientation. An elastic FEM analysis incorporating anisotropic thermal expansion and elastic constants indicated that the final orientation had an internal stress state that was 20–100% smaller than the initial orientation, when subjected to a temperature change. The release of elastic strain energy provided the thermodynamic driving force for recrystallization/grain growth.