Electrodeposition of hard magnetic films and microstructures

Electrochemical deposition of materials with hard magnetic properties in the as-deposited state is essential for the efficient integration of micro-magnetic components into MEMS devices. Here we discuss the growth process and the microstructure-magnetic properties correlation for two Co-rich alloys, Co–Ni–P and Co–Pt. Under suitable synthesis conditions, these materials exhibit perpendicular anisotropy and hard magnetic properties in the as-deposited state; in addition, such properties are maintained up to several micrometer film thickness through close control of the film microstructure. In the case of Co–Ni–P films we achieved a saturation magnetization of 1.21 T (963 emu/cm 3), perpendicular coercivity up to 188 kA/m (2.36 kOe) at a thickness of 10 μm, and energy products up to 4.2 kJ/m 3. Co-rich Co–Pt films were grown on several substrates – Cr, Cu(0 0 1), Cu(1 1 1), and Ru(0 0 0 1) – in order to control magnetic anisotropy and achieve optimum hard magnetic properties. Cu(1 1 1) contributes to stabilize the hexagonal hcp phase at high current density yielding excellent hard magnetic properties, although only in films thicker than 100 nm; saturation magnetization in these films was about 1.04 T (828 emu/cm 3). Perpendicular coercivities up to 485.6 kA/m (6.1 kOe) were obtained in 1 μm thick film deposited at 50 mA/cm 2. Ru(0 0 0 1) seed layers provide an appropriate interface structure to further facilitate the epitaxial growth of hcp films, yielding hard magnetic properties and perpendicular coercivity with a squareness ∼1 in films as thin as 10 nm. The hard magnetic properties were only marginally compromised at large film thickness. Deposition at higher current density (50 mA/cm 2) favored markedly improved hard magnetic properties. The Co–Pt films on Ru exhibited perpendicular anisotropy with anisotropy constant up to 1.2 MJ/m 3. The electrodeposition process was further extended to fill lithographically patterned hole arrays (850 nm diameter, center-to-center distance 2550 nm and about 700 nm thick resist), yielding arrays of micron-sized hard magnetic cylinders with perpendicular coercivity of 361 kA/m (4.54 kOe) and high squareness.