Fabrication of vertical optical interconnecting structure using photoresist reflowed mold structures

This paper demonstrates a simple fabrication process of an optical via structure which includes curved optical reflector. The fabrication process consists of two separate processes. Initially, the device master structure, for subsequent embossing processes, is fabricated using conventional photolith...

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Veröffentlicht in:Microelectronic engineering 2007-05, Vol.84 (5), p.1092-1095
Hauptverfasser: Lee, Min-Woo, Choi, Chul-Hyun, Kim, Bo-Soon, Sung, Jun-Ho, Jo, Soo-Beom, Yang, Jeong-Su, Lee, Seung-Gol, Park, Se-Geun, Lee, El-Hang, O, Beom-Hoan
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Sprache:eng
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Zusammenfassung:This paper demonstrates a simple fabrication process of an optical via structure which includes curved optical reflector. The fabrication process consists of two separate processes. Initially, the device master structure, for subsequent embossing processes, is fabricated using conventional photolithography process and thermal reflow process. The second process fabricates a PDMS mould using the master structure, and embosses the master structure shape on a glass substrate using a UV embossing process. Demonstration is performed using the replica and a green laser source. The replicated device showed successful vertical redirection of the inserted light, and proved its usability as an optical via structure.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2007.01.075