Characterization of the Heat Transfer Boundary Conditions during Cooling of a Horizontal Disk with a Water Column

To model the microstuctural and mechanical responses of quenched metallic components, the evolution of the thermal field must be known precisely; the latter, in turn, depends on accurate values of the thermal boundary conditions. In this work, the heat transfer boundary conditions on both sides of a...

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Veröffentlicht in:Materials science forum 2007-03, Vol.539-543, p.2479-2484
Hauptverfasser: Téllez-Martínez, J.S., Hernández-Morales, Bernie, Sánchez-Sarmiento, G.
Format: Artikel
Sprache:eng
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Zusammenfassung:To model the microstuctural and mechanical responses of quenched metallic components, the evolution of the thermal field must be known precisely; the latter, in turn, depends on accurate values of the thermal boundary conditions. In this work, the heat transfer boundary conditions on both sides of a stainless steel disk, held horizontally while a water column impinged on its lower surface to cool it from 850°C to room temperature, were characterized as heat flux histories which are functions of the radial coordinate. Thermal responses, measured with embedded thermocouples and a computer-controlled data acquisition system, were used to estimate the heat flux histories by solving the corresponding inverse heat conduction problem (IHCP), considering radial symmetry. The optimization problem also included the estimation of sub-areas associated with different heat extraction rates on both the lower and upper surfaces of the disk. The fluctuating interaction between the water column and the cooling disk was captured in the estimated heat flux histories. The estimated thermal boundary conditions were validated by computing the thermal response at the thermocouple locations by solving the direct heat conduction problem (DHCP) with a computer program based on the finite-element method. A good agreement between experimentally determined and computed thermal responses was observed, thus verifying the methodology employed.
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.539-543.2479