A study of 193-nm immersion lithography using novel high refractive index fluids

In search for the next 193-nm immersion lithography fluid, research and development continue to focus on low absorbance fluids with a refractive index n higher than 1.6. In this paper, the properties of a newly developed high refractive index fluid of low absorption coefficient named ‘Delphi’ will b...

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Veröffentlicht in:Microelectronic engineering 2006-04, Vol.83 (4), p.651-654
Hauptverfasser: Santillan, Julius, Otoguro, Akihiko, Itani, Toshiro, Fujii, Kiyoshi, Kagayama, Akifumi, Nakano, Takashi, Nakayama, Norio, Tamatani, Hiroaki, Fukuda, Shin
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Sprache:eng
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Zusammenfassung:In search for the next 193-nm immersion lithography fluid, research and development continue to focus on low absorbance fluids with a refractive index n higher than 1.6. In this paper, the properties of a newly developed high refractive index fluid of low absorption coefficient named ‘Delphi’ will be discussed. The refractive index of ‘Delphi’ at 193.39 nm was 1.63 and absorption coefficient was 0.08/cm as evaluated using a spectroscopic ellipsometer. Thirty two nanometer lines and spaces patterns imaging of excellent rectangular profiles were achieved with this fluid using a 193-nm two-beam interferometric exposure tool. The physical characteristics of ‘Delphi’ were also proven as feasible for application with possible future 193-nm high refractive index immersion lithography systems.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2005.12.028