A simple model for the Mode I popcorn effect for IC packages with copper leadframe

A simple model for the Mode I popcorn effect is presented here for packages with rectangular die pads (P-DSO). A package "stability parameter," relating to its moisture sensitivity, is derived from the popcorn model. It describes the critical factors for a robust package-molding compound p...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2002-06, Vol.25 (2), p.301-308
Hauptverfasser:	Alpern, P., Kheng Chooi Lee, Dudek, R., Tilgner, R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Environmentally friendly manufacturing techniques Integrated circuit modeling Integrated circuit packaging INTEGRATED CIRCUITS Lead LEAD FRAMES MATHEMATICAL ANALYSIS Mathematical models Moisture Packages PACKAGING Preconditioning Robustness SOLDERING Stability Temperature distribution Temperature sensors
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