A simple model for the Mode I popcorn effect for IC packages with copper leadframe

A simple model for the Mode I popcorn effect for IC packages with copper leadframe

A simple model for the Mode I popcorn effect is presented here for packages with rectangular die pads (P-DSO). A package "stability parameter," relating to its moisture sensitivity, is derived from the popcorn model. It describes the critical factors for a robust package-molding compound p...

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Veröffentlicht in:IEEE transactions on components and packaging technologies 2002-06, Vol.25 (2), p.301-308
Hauptverfasser: Alpern, P., Kheng Chooi Lee, Dudek, R., Tilgner, R.
Format: Artikel
Sprache:eng
Schlagworte:
Environmentally friendly manufacturing techniques
Integrated circuit modeling
Integrated circuit packaging
INTEGRATED CIRCUITS
Lead
LEAD FRAMES
MATHEMATICAL ANALYSIS
Mathematical models
Moisture
Packages
PACKAGING
Preconditioning
Robustness
SOLDERING
Stability
Temperature distribution
Temperature sensors
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Beschreibung
Zusammenfassung:A simple model for the Mode I popcorn effect is presented here for packages with rectangular die pads (P-DSO). A package "stability parameter," relating to its moisture sensitivity, is derived from the popcorn model. It describes the critical factors for a robust package-molding compound properties and package, leadframe design for a given preconditioning and soldering process. Furthermore, nomograms generated from the model facilitate an easy estimation of moisture sensitivity levels (between 1 and 5) of packages with different die pad sizes and molding compound underpad thicknesses and for different soldering temperatures ranging from 220/spl deg/C to 260/spl deg/C (lead-free soldering).
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2002.1010021