Sequential deposition of copper/alumina composites

In the present work, the authors studied Cu/Al2O3 coatings by the sequential EPD-EP deposition method. First, a layer of Al2O3 was produced by the EPD method. The kinetics of the EPD was studied to control the thickness of the deposited ceramic layer. After EPD, the ceramic coating was dipped into a...

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Veröffentlicht in:	Journal of materials science 2005-09, Vol.40 (18), p.4963-4965
Hauptverfasser:	WANG, X, MA, J, MAXIMENKO, A, OLEVSKY, E. A, STERN, M. B, GUENIN, B. M
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminum oxide Applied sciences Building materials. Ceramics. Glasses Ceramic industries Cermets, ceramic and refractory composites Chemical industry and chemicals Cross-disciplinary physics: materials science rheology Dispersion-, fiber-, and platelet-reinforced metal-based composites Exact sciences and technology Materials science Metals. Metallurgy Miscellaneous Other materials Physics Specific materials Technical ceramics
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Beschreibung
Zusammenfassung:	In the present work, the authors studied Cu/Al2O3 coatings by the sequential EPD-EP deposition method. First, a layer of Al2O3 was produced by the EPD method. The kinetics of the EPD was studied to control the thickness of the deposited ceramic layer. After EPD, the ceramic coating was dipped into a copper plating bath for impregnation. The resultant deposited coatings were characterized by Scanning Electron Microscope (SEM).
ISSN:	0022-2461 1573-4803
DOI:	10.1007/s10853-005-3869-4